A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor

被引:1
作者
Selvan, Mark [1 ]
Aziz, Mohd Sharizal Abdul [1 ]
Yu, Kok Hwa [1 ]
Nurulakmal, M. S. [2 ]
Ong, H. P. [3 ]
Khor, Chu Yee [4 ]
Rahiman, Wan [5 ]
机构
[1] Univ Sains Malaysia, Sch Mech Engn, Engn Campus, George Town, Malaysia
[2] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Engn Campus, George Town, Malaysia
[3] Furutec Elect Sdn Bhd, MK13 Simpang Ampat, George Town, Malaysia
[4] Univ Malaysia Perlis, Fac Mech Engn & Technol, George Town, Malaysia
[5] Univ Sains Malaysia, Cluster Smart Port & Logist Technol COSPALT, Engn Campus, George Town, Malaysia
关键词
Bus duct conductor; computational fluid dynamics; fin valley; heat sink; heat transfer; FLUID-FLOW CHARACTERISTICS; CONVECTION HEAT-TRANSFER; NATURAL-CONVECTION; PIN-FIN; THROUGH-HOLE; PLATE; SINKS; ORIENTATION; HEIGHT; PITCH;
D O I
10.1080/10407782.2022.2156409
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper presents a finite volume-based simulation study on the effect of the fin valley's number on the thermal performance of a bus duct conductor. A numerical model that closely mimics the experimental setup was developed using ANSYS FLUENT. The experimental data were used as a benchmark and followed the IEC 61439-1/2 standards. Five fin valley numbers were considered: s(1)=2, s(2)=3, s(3)=4, s(4)=5 and s(5)=6. It was determined that the average surface temperature decreased as the number of fin valleys increased. From the analysis, it was observed that as the number of fin valleys increased, convection heat transfer improved as a consequence of enhanced surface Nusselt number. The best number of fin valleys was s(5)=6, exhibiting superior thermal performance over a lower number of fin valleys. This study is expected to provide a better understanding of the fin valley's effects on the thermal performance of a bus duct conductor's casing.
引用
收藏
页码:781 / 800
页数:20
相关论文
共 32 条
[1]   The effect of fin height on forced convection heat transfer from rectangular fin array [J].
Aldoori W.H. .
Materials Today: Proceedings, 2023, 80 :3181-3188
[2]   Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow [J].
Aziz, M. S. Abdul ;
Abdullah, M. Z. ;
Khor, C. Y. ;
Jalar, A. ;
Ani, F. Che ;
Yan, Nobe ;
Cheok, C. .
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2016, 69 (03) :295-310
[3]   CFD modeling of pin shape effects on capillary flow during wave soldering [J].
Aziz, M. S. Abdul ;
Abdullah, M. Z. ;
Khor, C. Y. ;
Jalar, A. ;
Ani, F. Che .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 72 :400-410
[4]   Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach [J].
Aziz, M. S. Abdul ;
Abdullah, M. Z. ;
Nor, C. Y. ;
Ani, F. Che .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2013, 48 :116-123
[5]   Thermal performance and second law characteristics of two new microchannel heat sinks operated with hybrid nanofluid containing graphene-silver nanoparticles [J].
Bahiraei, Mehdi ;
Heshmatian, Saeed .
ENERGY CONVERSION AND MANAGEMENT, 2018, 168 :357-370
[6]   Thermal performance of open microchannel heat sink with variable pin fin height [J].
Bhandari, Prabhakar ;
Prajapati, Yogesh K. .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2021, 159
[7]   Optimization of plate fin heat sinks using entropy generation minimization [J].
Culham, JR ;
Muzychka, YS .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (02) :159-165
[8]   The Optimal Design of Heat Sinks: A Review [J].
Dhaiban, Hussein T. ;
Hussein, Maha A. .
JOURNAL OF APPLIED AND COMPUTATIONAL MECHANICS, 2020, 6 (04) :1030-1043
[9]   Pressure drop of impingement air cooled plate fin heat sinks [J].
Duan, Zhipeng ;
Muzychka, Y. S. .
JOURNAL OF ELECTRONIC PACKAGING, 2007, 129 (02) :190-194
[10]   Orientation effects on natural convective performance of hybrid fin heat sinks [J].
Effendi, Nico Setiawan ;
Kim, Kyoung Joon .
APPLIED THERMAL ENGINEERING, 2017, 123 :527-536