Effect of misorientation of grain boundaries on the discontinuous precipitates of Cu-Ni-Si alloy

被引:6
作者
Liao, Xianfeng [1 ]
Li, Linhan [1 ]
Ren, Kalubi [1 ]
Jia, Yanlin [1 ]
Pang, Yong [1 ]
Xiao, Zhu [1 ]
Jiang, Yanbin [1 ]
Li, Zhou [1 ]
机构
[1] Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China
来源
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2023年 / 26卷
基金
中国国家自然科学基金;
关键词
CueNieSi alloy; Discontinuous precipitation; Grain boundary; Misorientation Electron backscatter diffraction (EBSD); BEHAVIOR;
D O I
10.1016/j.jmrt.2023.08.056
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, the effects of differences in grain size, grain boundary type and misorientation on the initiation of discontinuous precipitates are investigated for the Cue5Ni e1.25Si alloy. Samples with different grain sizes are obtained by thermomechanical treatment, and the smaller the grain size, the higher the percentage of discontinuous precipitate at the same aging time, while there is no significant difference in the growth rate of the reaction front of discontinuous precipitates. EBSD is used to study the effect of grain boundary misorientation on discontinuous precipitates, the characteristics of discontinuous precipitates initiation on different grain boundaries are investigated by multivariate statistical analysis. It is found that discontinuous precipitates only initiate from random grain boundaries instead of coincident site lattice boundaries, where random grain boundaries with misorientation angles of 30-50 degrees are more prone to discontinuous precipitates. And the initiation of DPs at different misorientation axes is different. There is a clear borderline for the axes such as < 102 >, < 103 >, and < 203 >. The grain boundaries below this borderline do not initiate DP, while all grain boundaries below this angle initiate DPs. The cases for axes such as < 112 >, < 114 >, and < 214 > are more complicated. On these misorientation axes, grain boundaries with lower or higher misorientation angles do not initiate DPs, while grain boundaries at intermediate range misorientation angles do initiate DPs. (c) 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:2060 / 2069
页数:10
相关论文
共 31 条
[1]   Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation [J].
Ahn, Jee Hyuk ;
Han, Seung Zeon ;
Choi, Eun-Ae ;
Lee, Geun Young ;
Kim, Kwangho ;
Lee, Jehyun ;
Han, Heung Nam .
MATERIALS CHARACTERIZATION, 2022, 184
[2]   On the discontinuous precipitation reaction and solute redistribution in a Cu-15%Ni-8%Sn alloy [J].
Alili, B. ;
Bradai, D. ;
Zieba, P. .
MATERIALS CHARACTERIZATION, 2008, 59 (10) :1526-1530
[3]  
Findik F, 1998, J MATER SCI LETT, V17, P79, DOI 10.1023/A:1006510228181
[4]   GENESIS OF CELLULAR PRECIPITATION REACTION [J].
FOURNELLE, RA ;
CLARK, JB .
METALLURGICAL TRANSACTIONS, 1972, 3 (11) :2757-+
[5]   Simultaneous increase in electrical conductivity and fatigue strength of Cu-Ni-Si alloy by utilizing discontinuous precipitates [J].
Goto, M. ;
Yamamoto, T. ;
Han, S. Z. ;
Utsunomiya, T. ;
Kim, S. ;
Kitamura, J. ;
Ahn, J. H. ;
Lim, S. H. ;
Lee, J. .
MATERIALS LETTERS, 2021, 288
[6]   Fatigue crack initiation and propagation behaviors of solution-treated and air-cooled Cu-6Ni-1.5Si alloy strengthened by precipitation hardening [J].
Goto, M. ;
Iwamura, T. ;
Han, S. Z. ;
Kim, S. ;
Yamamoto, T. ;
Lim, S. H. ;
Ahn, J. -H. ;
Kitamura, J. ;
Lee, J. .
INTERNATIONAL JOURNAL OF FATIGUE, 2019, 123 :135-143
[7]   Alloy design strategies to increase strength and its trade-offs together [J].
Han, Seung Zeon ;
Choi, Eun-Ae ;
Lim, Sung Hwan ;
Kim, Sangshik ;
Lee, Jehyun .
PROGRESS IN MATERIALS SCIENCE, 2021, 117
[8]   Discontinuous precipitation at the deformation band in copper alloy [J].
Han, Seung Zeon ;
Ahn, Jee Hyuk ;
You, Young Soo ;
Lee, Jehyun ;
Goto, Masahiro ;
Kim, Kwangho ;
Kim, Sangshik .
METALS AND MATERIALS INTERNATIONAL, 2018, 24 (01) :23-27
[9]   Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound [J].
Han, Seung Zeon ;
Lim, Sung Hwan ;
Kim, Sangshik ;
Lee, Jehyun ;
Goto, Masahiro ;
Kim, Hyung Giun ;
Han, Byungchan ;
Kim, Kwang Ho .
SCIENTIFIC REPORTS, 2016, 6
[10]   CHEMICALLY-INDUCED GRAIN-BOUNDARY MIGRATION [J].
HILLERT, M ;
PURDY, GR .
ACTA METALLURGICA, 1978, 26 (02) :333-340