共 17 条
- [1] Next Generation 5G Wireless Networks: A Comprehensive Survey [J]. IEEE COMMUNICATIONS SURVEYS AND TUTORIALS, 2016, 18 (03): : 1617 - 1655
- [2] [Anonymous], 2014, P IEEE INT C EL DEV
- [3] Investigation of power amplifier performance under load mismatch conditions [J]. 2021 IEEE TOPICAL CONFERENCE ON RF/MICROWAVE POWER AMPLIFIERS FOR RADIO AND WIRELESS APPLICATIONS (PAWR), 2021, : 41 - 43
- [4] Massive MIMO and mmWave for 5G Wireless HetNet Potential Benefits and Challenges [J]. IEEE VEHICULAR TECHNOLOGY MAGAZINE, 2016, 11 (01): : 64 - 75
- [5] Distributed circuit modeling of multilayer capacitor parameters related to the metal film layer [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (04): : 764 - 773
- [8] An Empirical Formulation for Predicting the Thickness of Multilayer PCB [J]. COMPOSITES RESEARCH, 2022, 35 (03): : 182 - 187
- [9] Innovative Packaging Solutions of 3D Integration and System in Package for IoT/Wearable and 5G Application [J]. 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 515 - 518
- [10] Maric A, 2016, INT SPR SEM ELECT TE, P510, DOI 10.1109/ISSE.2016.7563251