Cause analysis on the unqualified pull-out force between the bushing and PCB pad in DC-DC converters for new energy vehicles

被引:3
作者
Chen, Jie [1 ]
Yang, Zhen-Guo [1 ]
机构
[1] Fudan Univ, Dept Mat Sci, Shanghai 200433, Peoples R China
关键词
New energy vehicles; DC -DC converter; Bushing; PCB; Failure analysis; FAILURES; SIZE;
D O I
10.1016/j.engfailanal.2022.107012
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
For new energy vehicles, the DC-DC converter is a key component to realize the electricity conversion between different voltage networks. In the DC-DC converter described in this paper, the copper-substrate bushing was specially designed to fix the PCB onto the aluminum radiator, and thereby the heat generated by the components on the PCB could be successfully dissipated. However, during the ejection tests after reflow soldering, the pull-out force between the bushing and PCB pad was unqualified. To find out the failure causes, the comprehensive characterization analysis and failure analysis were carried out and the analysis objects included the material quality, solder paste printing, reflow soldering process, soldering void and morphology characteristics. Through systematical investigation, the causes of the unqualified pull-out force between the bushing and PCB pad after reflow soldering were finally determined, and some countermeasures were put forward as well. Hopefully, the achievements of the paper could not only provide useful references for avoiding the recurrence of similar problems, but also improve the product quality in the future manufacturing process.
引用
收藏
页数:17
相关论文
共 21 条
[1]   Bushing failure in power transformers and the influence of moisture with the spectroscopy test [J].
Arias Velasquez, Ricardo Manuel ;
Mejia Lara, Jennifer Vanessa .
ENGINEERING FAILURE ANALYSIS, 2018, 94 :300-312
[2]   Failures on DC-DC modules following a change of wire bonding material from gold to copper [J].
Belfort, Y. ;
Caignard, J. -M. ;
Keller, S. ;
Guerveno, J. -P. .
MICROELECTRONICS RELIABILITY, 2015, 55 (9-10) :2003-2006
[3]   Flux effect on void quantity and size in soldered joints [J].
Busek, D. ;
Dusek, K. ;
Ruzicka, D. ;
Placek, M. ;
Mach, P. ;
Urbanek, J. ;
Stary, J. .
MICROELECTRONICS RELIABILITY, 2016, 60 :135-140
[4]   Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times [J].
Gong, Shiliang ;
Chen, Gaoqiang ;
Qu, Songtao ;
Ren, Anshi ;
Duk, Vichea ;
Shi, Qingyu ;
Zhang, Gong .
MICROELECTRONICS RELIABILITY, 2021, 127
[5]   Power switch failures tolerance and remedial strategies of a 4-leg floating interleaved DC/DC boost converter for photovoltaic/fuel cell applications [J].
Guilbert, Damien ;
Gaillard, Arnaud ;
N'Diaye, Abdoul ;
Djerdir, Abdesslem .
RENEWABLE ENERGY, 2016, 90 :14-27
[6]   A prognostic method for predicting failure of dc/dc converter [J].
He Qingchuan ;
Chen Wenhua ;
Pan Jun ;
Qian Ping .
MICROELECTRONICS RELIABILITY, 2017, 74 :27-33
[7]  
Hwang J.H., APPL SURF SCI, V454
[8]   Stability and reliability of LTCC-based 5/12 V dual output DC-DC converter with high efficiency and small size [J].
Jung, Dong Yun ;
Jang, Hyun Gyu ;
Cho, Doohyung ;
Park, Kun Sik ;
Lim, Jong-Won ;
Lee, Yong Ha ;
Son, Seok-Ho .
MICROELECTRONICS JOURNAL, 2020, 106
[9]   Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering [J].
Najib, A. M. ;
Abdullah, M. Z. ;
Saad, A. A. ;
Samsudin, Z. ;
Ani, F. Che .
MICROELECTRONICS RELIABILITY, 2017, 79 :69-78
[10]   Performance optimization of mild hybrid passenger vehicle by dual control strategy for city driving cycle [J].
Shanu, Pataparambath Noyalraj ;
Senthilkumar, Subramaniam .
ENERGY, 2021, 214