Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil interlayer

被引:2
|
作者
Rajendran, Sri Harini [1 ]
Lee, Gyeong Ah [1 ]
Park, Jin Yong [2 ]
Kang, Young Su [2 ]
Jung, Jae Pil [1 ]
机构
[1] Univ Seoul, Dept Mat Sci & Engn, 163 Seoulsiripdae Ro, Seoul 02504, South Korea
[2] LIG Nex1 Co Ltd, 333 Pangyo Ro, Seongnam Si, Gyeonggi Do, South Korea
关键词
Silicon nitride; Active metal brazing; Molybdenum mesh; Vickers microhardness; Shear strength; SILICON-NITRIDE; MICROSTRUCTURAL EVOLUTION; MECHANICAL-PROPERTIES; FILLER ALLOY; TI FILLER; JOINTS; SUPERALLOY; COMPOSITE; STRESSES; FOAM;
D O I
10.1016/j.matchemphys.2023.128732
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Si3N4/Invar joints with Mo mesh and Cu foil as interlayers, individually and together, were vacuum brazed using Ag27.5Cu4.5Ti active filler at 1153 K for 10 min with following configurations: Si3N4/Ag26.7Cu4.5Ti + Mo/ Invar, and Si3N4/Ag26.7Cu4.5Ti + Mo/Cu/Ag-Cu/Invar. The correlation between the microstructure of the brazing seam and shear strength of the joints are investigated. Ti segregated at Si3N4/filler interface and metallurgical bonding is established by formation of TiN and Ti5Si3 reaction products. Vickers microharndess profiles unveiled varying degrees of hardness across the brazing seam, resembling the layered structure. Indi-vidually introducing Mo mesh as interlayer suppressed the Fe2Ti and Ni3Ti intermetallic compounds (IMC) within the brazing seam, resulting in shear strength of 191.7 MPa. Hybrid combination of Mo mesh with Cu foil as interlayers, yielded 235.5 MPa shear strength in brazed Si3N4/Invar joints. This improvement is attributed to simultaneous favorable effects of Mo such as reduced residual stress near the Si3N4/filler interface and Cu, which prevents Fe2Ti and Ni3Ti IMC in the brazing seam, thereby enhancing the plastic flow.
引用
收藏
页数:12
相关论文
共 50 条
  • [21] Joining mechanism in Si3N4 bonded with a Ni-Cr-B interlayer
    Liang, YN
    Osendi, MI
    Miranzo, P
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2003, 23 (03) : 547 - 553
  • [22] SiC and Si3N4 ceramic joining by transient eutectic phase process
    Lee, JK
    Katoh, Y
    Kohyama, A
    27TH INTERNATIONAL COCOA BEACH CONFERENCE ON ADVANCED CERAMICS AND COMPOSITES: B, 2003, 24 (04): : 325 - 330
  • [23] Bonding properties of joining Si3N4/SiC ceramic by SiC adhesive
    National Key Laboratory of Thermostructure Composite Materials, Northwestern Polytechnical University, Xi'an 710072, China
    Cailiao Gongcheng, 2006, 8 (23-27+32):
  • [24] Joining of Si3N4 using Al and Ni interlayers
    Jacquemin, JP
    Juve, D
    Treheux, D
    Miranzo, P
    Osendi, MI
    INTERFACIAL SCIENCE IN CERAMIC JOINING, 1998, 58 : 135 - 142
  • [25] JOINING OF REACTION BONDED SI3N4 USING AL
    IKUHARA, Y
    KOBAYASHI, M
    YOSHINAGA, H
    YOGYO-KYOKAI-SHI, 1987, 95 (09): : 921 - 928
  • [26] Wetting and joining between Si3N4 ceramic and Cu-Ni-Ti alloy brazing filler
    Dept. of Mat. Sci. and Engineering, Jinlin University of Technology, Changchun 130025, China
    不详
    Jinshu Xuebao, 5 (527-530):
  • [27] Titanium metallization of Si3N4 by molten salt reaction and its application in Si3N4/Si3N4 joining
    Chen, J
    Pan, W
    Zheng, SY
    Huang, Y
    PROCEEDINGS OF THE FIRST CHINA INTERNATIONAL CONFERENCE ON HIGH-PERFORMANCE CERAMICS, 2001, : 578 - 580
  • [28] Development of a new CuNiTiB brazing alloy for joining Si3N4 to Si3N4
    Huaping Xiong
    Chuangeng Wan
    Zhenfeng Zhou
    Metallurgical and Materials Transactions A, 1998, 29 : 2591 - 2596
  • [29] Development of a new CuNiTiB brazing alloy for joining Si3N4 to Si3N4
    Xiong, Huaping
    Wan, Chuangeng
    Zhou, Zhenfeng
    Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 1998, 29 A (10): : 2591 - 2596
  • [30] Joining of Si3N4 to Si3N4 using rapidly-solidified CuNiTiB brazing filler foils
    Xiong, HP
    Wan, CG
    Zhou, ZF
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1998, 75 (1-3) : 137 - 142