The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy

被引：2

作者：

State , Sabrina Patricia ^{[1
,2
,3
]}

Costovici, Stefania ^{[3
]}

Enachescu, Marius ^{[3
]}

Visan, Teodor ^{[3
]}

Anicai, Liana ^{[3
]}

机构：

[1] Natl Univ Sci & Technol Politehn Bucharest, Fac Med Engn, 1-7 Gheorghe Polizu St, Bucharest 011061, Romania

[2] Natl Inst Res & Dev Microtechnol IMT Bucharest, 126A Erou Iancu Nicolae, Bucharest 077190, Romania

[3] Natl Univ Sci & Technol Politehn Bucharest, Ctr Surface Sci & Nanotechnol, Splaiul Independentei 313, Bucharest 060042, Romania

来源：

MATERIALS | 2024年 / 17卷 / 05期

关键词：

Sn-Cu-Ni ternary alloy; electrodeposition; reflowing process; anti-corrosive properties; CORROSION BEHAVIOR; MICROSTRUCTURE; AG;

D O I：

10.3390/ma17051034

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Sn-Cu-Ni lead-free solder alloy electrodeposited on copper substrate from a deep eutectic solvent (DES)-based electrolyte under direct current (DC) and pulsed current (PC) was subjected to a reflowing process at the industrial company MIBATRON S.R.L. (Otopeni, Romania). The alteration of the alloy's composition and anti-corrosive properties upon exposure to the reflow process were investigated via Scanning Electron Microscopy (SEM-EDX), X-ray diffraction (XRD), linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Corrosion studies conducted in sodium chloride solution revealed that the system obtained under the DC plating mode (Sn-Cu-Ni-DC) exhibited enhanced anti-corrosive properties compared to the system obtained under PC (Sn-Cu-Ni-PC) after reflowing. However, prior to reflowing, the opposite effect was observed, with Sn-Cu-Ni-PC showing improved anti-corrosive properties. These changes in anti-corrosive behavior were attributed to the modification of the alloy's composition during the reflowing process.

引用

页数：14

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