Enhanced Properties of Ti/Al Laminated Composite Reinforced by High-Entropy Alloy Particles

被引:3
作者
Wang, Enhao [1 ]
Lv, Lisong [1 ]
Kang, Fuwei [1 ]
Li, Shangzhuo [2 ]
Li, Jiaqi [1 ]
Tian, Yao [3 ]
Jiang, Wei [1 ]
Song, Xiaogang [4 ]
机构
[1] Harbin Univ Sci & Technol, Sch Mat Sci & Chem Engn, Harbin 150040, Peoples R China
[2] Harbin Dongan High Precis Tube Shaft Mfg Co Ltd, Harbin 150060, Peoples R China
[3] Xian Inst Appl Opt, Xian 710065, Peoples R China
[4] Jiamusi Univ, Sch Mat Sci & Engn, Jiamusi 154007, Peoples R China
基金
中国国家自然科学基金;
关键词
HEA(p)-Ti; Al laminated composites; high-entropy alloy; mechanical properties; microstructure characterization; MECHANICAL-PROPERTIES; FRACTURE-BEHAVIOR; MICROSTRUCTURE; DEFORMATION; LAYER; TEMPERATURE; EVOLUTION; TENSILE;
D O I
10.3390/met13071227
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Novel HEA(p)-Ti/Al laminated composites embedded with particles of the high-entropy alloy Al0.5CoCrFeNi (HEA) were fabricated by vacuum hot-press sintering at 730 & DEG;C. The phase composition and microstructure of the composites were studied with X-ray diffractometer (XRD), scanning electron microscope SEM, energy dispersive spectrometer (EDS), transmission electron microscope (TEM), and electron backscattering diffraction (EBSD) techniques. At this temperature, it has been observed that Al3Ti intermetallic compound is the favored phase and the reaction results in the dispersion of Al3Ti in the original Al layer. A large number of interfaces are formed between Al3Ti and Al. The deformed Al3Ti grains are concentrated in the interface near the Ti side. The mechanical properties, including tensile and compressive properties at room temperature, were analyzed. The tensile test results indicate that the composite exhibited an average tensile strength of 258 MPa and an average yield strain of 9.86%. Compression test results show that when a load perpendicular to the layer is applied, the yield strain and yield stress of the material are 9.67% and 474.09 MPa, respectively. Moreover, under a load parallel to the layer, the material fails due to interfacial debonding.
引用
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页数:13
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