Mimicking swallow nest structure to construct 3D rGO/BN skeleton for enhancing the thermal conductivity of the silicone rubber composites

被引:9
作者
Ji, Xiaowang [1 ]
Wang, Zhijian [1 ]
Wang, Junyan [1 ]
Ye, Neng [1 ]
Zhang, Huan [1 ]
Lu, Zhaoyu [1 ]
Li, Jingchao [1 ,3 ,4 ]
Lu, Yonglai [1 ,2 ]
机构
[1] Beijing Univ Chem Technol, State Key Lab Organ Inorgan Composites, Beijing 100029, Peoples R China
[2] Beijing Univ Chem Technol, Engn Res Ctr Elastomer Mat Energy Conservat & Reso, Minist Educ, Beijing 100029, Peoples R China
[3] Beijing Forestry Univ, Key Lab Wood Mat Sci & Applicat, Minist Educ, Beijing 100083, Peoples R China
[4] Beijing Forestry Univ, Beijing Key Lab Wood Sci & Engn, Beijing 100083, Peoples R China
基金
北京市自然科学基金; 中国国家自然科学基金;
关键词
Swallow nest structure; Graphene oxide; Boron nitride; Thermal conductivity; Silicone rubber composites; POLYMER COMPOSITES; GRAPHENE; HYBRID; FILMS; NANO;
D O I
10.1016/j.compscitech.2024.110473
中图分类号
TB33 [复合材料];
学科分类号
摘要
Ever-increasing heat flux density in electronic systems has posed significant challenges to their efficient thermal management, and therefore, there is an urgent need for high-performance thermal management materials. However, conventional heat-conducting rubber composites require extremely high filler loadings to achieve high thermal conductivities, which may compromise mechanical properties, flexibility, and cost. Herein, we take inspiration from the structure of the swallow nest and successfully construct a 3D continuous skeleton with reduced graphene oxide (rGO) sheets and boron nitride (BN) plates. This 3D rGO/BN skeleton is modeled on air bubbles and has a porous structure similar to a swallow nest, endowing the silicone rubber composite with excellent thermal conductivity. The resulting 3D T-rGO/BN/PDMS composites exhibited significantly enhanced thermal conductivity (up to 1.41 W/mK) at low filler loadings (14.3 vol%). Model fitting analysis and finite element simulations deeply revealed the mechanisms behind the superior thermal conductive performance of the composites. This strategy provides valuable guidance for low-cost, large-scale preparation of heat-conducting rubber composites, which is expected to be applied to heat dissipation of emerging electronic devices.
引用
收藏
页数:9
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