Understanding phonon thermal transport mechanism of novel two-dimensional (2D) organic C-60 networks is crucial for the preparation of functionalized nanoelectronics. In this study, the in-plane thermal conductivities of monolayer and bilayer quasi-hexagonal phase C-60 (QHP C-60) and quasi-tetragonal phase C-60 (QTP C60) are comprehensively investigated and phonon transport mechanisms are thoroughly elucidated. Compared to C-60 single crystals, the thermal conductivities of 2D organic C-60 networks are elevated by 1 similar to 2 orders of magnitude. The thermal conductivities of bilayer C-60 networks are significantly lower than monolayer C-60 networks. Furthermore, thermal transport is mainly dominated by < 10 THz low frequency phonons. The phonon modes of bilayer C-60 networks exhibit the redshift phenomenon, which reduces the phonon group velocity and phonon mean free path. Consequently, the thermal conductivities of bilayer C-60 networks are suppressed. Moreover, the enhancement of interlayer coupling intensifies anharmonic properties and disrupts the low frequency phonon branch, which results in the localization of low frequency phonons to hinder thermal transport in bilayer-QHP C-60 and bilayer-QTP C-60. Further, the bonding interaction is the major contributor of thermal transport in bilayer C-60 networks. The improvement of interlayer coupling fully suppresses the contributions of bonding and nonbonding to degrade the phonon thermal transport.
机构:
Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
HKUST Shenzhen Hong Kong Collaborat Innovat Res In, Shenzhen, Guangdong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
Fan, Hongzhao
Yang, Can
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Hong Kong Univ Sci & Technol, Dept Math, Clear Water Bay, Hong Kong, Peoples R China
Hong Kong Univ Sci & Technol, Guangdong Hong Kong Macao Joint Lab Data Driven Fl, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
Yang, Can
Zhou, Yanguang
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Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
HKUST Shenzhen Hong Kong Collaborat Innovat Res In, Shenzhen, Guangdong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
机构:
Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Gu, Xiaokun
Li, Baowen
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Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Li, Baowen
Yang, Ronggui
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Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Univ Colorado, Mat Sci & Engn Program, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA
机构:
Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
HKUST Shenzhen Hong Kong Collaborat Innovat Res In, Shenzhen, Guangdong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
Fan, Hongzhao
Yang, Can
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机构:
Hong Kong Univ Sci & Technol, Dept Math, Clear Water Bay, Hong Kong, Peoples R China
Hong Kong Univ Sci & Technol, Guangdong Hong Kong Macao Joint Lab Data Driven Fl, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
Yang, Can
Zhou, Yanguang
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机构:
Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
HKUST Shenzhen Hong Kong Collaborat Innovat Res In, Shenzhen, Guangdong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Clear Water Bay, Hong Kong, Peoples R China
机构:
Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Gu, Xiaokun
Li, Baowen
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h-index: 0
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Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Li, Baowen
Yang, Ronggui
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h-index: 0
机构:
Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
Univ Colorado, Mat Sci & Engn Program, Boulder, CO 80309 USAUniv Colorado, Dept Mech Engn, Boulder, CO 80309 USA