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- [4] HIGH-FREQUENCY, HIGH-TEMPERATURE ULTRASONIC TRANSDUCERS NDT INTERNATIONAL, 1990, 23 (05): : 262 - 266
- [5] Thin-Film Multichip Packaging for High-Temperature Geothermal Application IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (05): : 692 - 702
- [8] Thin-Film Lithium Niobate Based Piezoelectric Micromachined Ultrasound Transducers PROCEEDINGS OF THE 2020 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2020,
- [10] Thin-Film Flip-Chip Assembly for High-Temperature Geothermal Application IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (02): : 193 - 200