Influence of substrate type on deformation specificity of soft film/hard substrate coated systems under nanomicroindentation

被引:1
作者
Grabco, Daria [1 ,3 ]
Pyrtsac, Constantin [1 ,2 ]
Shikimaka, Olga [1 ]
机构
[1] Moldova State Univ, Inst Appl Phys, Kishinev, Moldova
[2] Tech Univ Moldova, Kishinev, Moldova
[3] Moldova State Univ, Inst Appl Phys, 5 Acad Str, MD-2028 Kishinev, Moldova
关键词
Depth-sensing indentation; Cu; MgO and Cu; Si coated systems; chemical bond; hardness; elastoplastic properties; deformation mechanism; MECHANICAL-PROPERTIES; THIN-FILMS; PHASE-TRANSFORMATIONS; SURFACE-MORPHOLOGY; GRAIN-BOUNDARY; NANOINDENTATION; SILICON; HARDNESS; INDENTATION; MODULUS;
D O I
10.1080/14786435.2023.2181995
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work is devoted to the study of the effect of a substrate chemical bonding type on the mechanical properties of coated systems (CSs) of a soft film/hard substrate type. The Cu/MgO and Cu/Si coated systems, as well as MgO and Si substrate crystals, which have similar hardness values but different types of chemical bonds, were studied. Various elastoplastic parameters were compared. The general and specific features of the deformation process under nanomicroindentation were identified. It has been established that general properties, such as 'pop-in', 'pop-out', 'elbow' effects, indentation size effect (ISE), are determined by the stress state created in the material during the indenter penetration and depend on the magnitude of the applied load and the film thickness. The specific properties, Young's modulus, hardness, relaxation parameters depend on the crystal structure and elastoplastic properties of the film and substrate material. The difference in the type of chemical bonding of the substrates, despite the close values of hardness, changes the elastoplastic properties and deformation mechanism of the composite structure as a whole, thereby expanding the possibility of creating new materials required for modern technology.
引用
收藏
页码:1146 / 1176
页数:31
相关论文
共 54 条
[1]  
Alshits V.I., 1975, BOOK DYNAMICS DISLOC, P232
[2]   Application of composite hardness models to copper thin film hardness measurement [J].
Beegan, D ;
Laugier, MT .
SURFACE & COATINGS TECHNOLOGY, 2005, 199 (01) :32-37
[3]   The nanoindentation behaviour of hard and soft films on silicon substrates [J].
Beegan, D ;
Chowdhury, S ;
Laugier, MT .
THIN SOLID FILMS, 2004, 466 (1-2) :167-174
[4]  
Boyarskaya D.Z., 1986, KATS PHYS MICROINDEN
[5]   Near-perfect elastoplasticity in pure nanocrystalline copper [J].
Champion, Y ;
Langlois, C ;
Guérin-Mailly, S ;
Langlois, P ;
Bonnentien, JL ;
Hÿtch, MJ .
SCIENCE, 2003, 300 (5617) :310-311
[6]   Mechanical properties and deformation behaviors of surface-modified silicon: a molecular dynamics study [J].
Chen, Juan ;
Shi, Junqin ;
Chen, Zhi ;
Zhang, Meng ;
Peng, Weixiang ;
Fang, Liang ;
Sun, Kun ;
Han, Jing .
JOURNAL OF MATERIALS SCIENCE, 2019, 54 (04) :3096-3110
[7]   Nanoindentation and deformation behaviors of silicon covered with amorphous SiO2: a molecular dynamic study [J].
Chen, Juan ;
Shi, Junqin ;
Wang, Yunpeng ;
Sun, Jiapeng ;
Han, Jing ;
Sun, Kun ;
Fang, Liang .
RSC ADVANCES, 2018, 8 (23) :12597-12607
[8]   Investigation of the mechanical properties of thin films by nanoindentation, considering the effects of thickness and different coating-substrate combinations [J].
Chen, SH ;
Liu, L ;
Wang, TC .
SURFACE & COATINGS TECHNOLOGY, 2005, 191 (01) :25-32
[9]   In situ TEM nanoindentation and dislocation-grain boundary interactions: a tribute to David Brandon [J].
De Hosson, Jeff T. M. ;
Soer, Wouter A. ;
Minor, Andrew M. ;
Shan, Zhiwei ;
Stach, Eric A. ;
Asif, S. A. Syed ;
Warren, Oden L. .
JOURNAL OF MATERIALS SCIENCE, 2006, 41 (23) :7704-7719
[10]   Nanoindentation-induced defect-interface interactions: Phenomena, methods and limitations [J].
Gerberich, WW ;
Kramer, DE ;
Tymiak, NI ;
Volinsky, AA ;
Bahr, DF ;
Kriese, MD .
ACTA MATERIALIA, 1999, 47 (15-16) :4115-4123