Additive Manufacturing of Multimaterial Composites for Radiation Shielding and Thermal Management

被引：17

作者：

Beck, Devon ^{[1
]}

Bickus, Jacob ^{[1
,2
]}

Klein, Ethan ^{[2
]}

Miller, Paul ^{[1
]}

Di Cecca, Salvatore ^{[1
]}

Benz, Ryan ^{[1
]}

Barney, Andrea ^{[1
]}

Longton, Robert ^{[1
]}

Coon, Austin ^{[1
]}

Smith, Melissa ^{[1
]}

Duncan, Bradley ^{[1
]}

机构：

[1] MIT, Lincoln Lab, Lexington, MA 02421 USA

[2] MIT, Dept Nucl Engn, Cambridge, MA 02139 USA

来源：

ACS APPLIED MATERIALS & INTERFACES | 2023年 / 15卷 / 29期

关键词：

3D printing; composites; direct ink writing; radiation shielding; multimaterial; BORON-NITRIDE COMPOSITES; DIFFUSIVITY; FILMS; EARTH;

D O I：

10.1021/acsami.2c22478

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The harsh radiation environment of space induces thedegradationand malfunctioning of electronic systems. Current approaches for protectingthese microelectronic devices are generally limited to attenuatinga single type of radiation or require only selecting components thathave undergone the intensive and expensive process to be radiation-hardenedby design. Herein, we describe an alternative fabrication strategyto manufacture multimaterial radiation shielding via direct ink writingof custom tungsten and boron nitride composites. The additively manufacturedshields were shown to be capable of attenuating multiple species ofradiation by tailoring the composition and architecture of the printedcomposite materials. The shear-induced alignment during the printingprocess of the anisotropic boron nitride flakes provided a facilemethod for introducing favorable thermal management characteristicsto the shields. This generalized method offers a promising approachfor protecting commercially available microelectronic systems fromradiation damage and we anticipate this will vastly enhance the capabilitiesof future satellites and space systems.

引用

页码：35400 / 35410

页数：11

共 64 条

[51] Bioinspired Modification of h-BN for High Thermal Conductive Composite Films with Aligned Structure [J].