Welcome to the November Issue

被引：0
作者：
Caverly, Robert H. [1 ]
机构：
[1] Villanova Univ, Villanova, PA 19085 USA
来源：
IEEE MICROWAVE MAGAZINE | 2023年 / 24卷 / 11期
关键词：
D O I：
10.1109/MMM.2023.3305908
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The two major microwave events of the year, the 2023 editions of the International Microwave Symposium (IMS) and European Microwave Week, are now in the history books. By all accounts, the conference circuit is fully back to normal with busy sessions, packed exhibit floors, and a myriad conversations in hallways and at coffee breaks. In addition to the stimulating conversations and learning about new microwave technologies, conferences provide us with a chance to "recharge our batteries" so that when we return to our offices and laboratories, we have new motivation to continue to develop the next technologies needed to improve communications and sensing.
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页码：6 / +
页数：3
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