Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect

被引：0

作者：

Riaz, Rabia Fatima ^{[1
]}

Protze, Florian ^{[1
]}

Hoyer, Christian ^{[1
]}

Wagner, Jens ^{[1
,2
]}

Ellinger, Frank ^{[1
,2
]}

机构：

[1] Tech Univ Dresden, Chair Circuit Design & Network Theory, Dresden, Germany

[2] Tech Univ Dresden, Ctr Tactile Internet Human In The Loop CeTI, Dresden, Germany

来源：

2023 21ST IEEE INTERREGIONAL NEWCAS CONFERENCE, NEWCAS | 2023年

关键词：

Bond-wire; Impedance matching; Voltage controlled Oscillator; phase locked loops; integrated circuit interconnects; millimeter wave measurements;

D O I：

10.1109/NEWCAS57931.2023.10198099

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a bond-wire impedance compensation technique based on using bond-wires as a half-wavelength long transmission line is designed, implemented and experimentally verified for a 60 GHz interconnection between an integrated circuit (IC) and printed circuit board (PCB). For this purpose, electromagnetic simulations (EM) of the entire interconnection i.e. the IC, the bond-wire and the PCB are performed and subsequently characterized experimentally. The comparison of the measurements with the simulations shows a good agreement. It is found that although the bond-wires are about 2.4mm long, the measured insertion loss is better than 0.66 dB at 60 GHz and a -10 dB reflection bandwidth from 57.5 GHz to 64 GHz can be achieved. Furthermore a technique is proposed to ease the implementation of such a long interconnection and to help in maintaining the desired parallelism between the bond-wires.

引用

页数：5

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