Influence of Cu interlayer on the interfacial strengthening of the diffusion-bonded SS-304L/IN718

被引：6

作者：

Khan, Salman ^{[1
]}

Junaid, Massab ^{[1
]}

Shehbaz, Tauheed ^{[2
]}

Khan, Fahd Nawaz ^{[2
]}

机构：

[1] Ghulam Ishaq Khan Inst Engn Sci & Technol, Fac Mech Engn FME, Swabi 23460, Pakistan

[2] Ghulam Ishaq Khan Inst Engn Sci & Technol, Fac Mat & Chem Engn FMCE, Swabi 23460, Pakistan

来源：

MATERIALS LETTERS | 2024年 / 358卷

关键词：

Diffusion bonding; Microstructure; Inconel; 718; Copper interlayer; Intermetallic compound: X-ray techniques; ALLOY;

D O I：

10.1016/j.matlet.2023.135829

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Diffusion bonding (DB) of AISI 304L austenitic stainless steel (SS-304L) and Inconel 718 with and without Cu interlayer was performed at 950 degrees C for 90 min under vacuum of 8x10(-2) MPa. The resulting mechanical, microstructural, and compositional analyses of the bonded interfaces were analyzed using lap shear and microhardness tests, optical and scanning electron microscopes (OM and SEM) equipped with energy-dispersive spectroscope (EDS) and X-ray diffraction (XRD). It was observed that the bonding interface without Cu interlayer was comprised of TiC, NbC, Mn23C7, Cr23C6, Cr3C2, mu-phase (Fe2Nb), NiTi2, and FeTi. However, these carbides and intermetallic compounds (IMCs) were eliminated with the insertion of the Cu interlayer. This enhanced the joint strength from 143 to 334 MPa and reduced the interfacial hardness by 17 %.

引用

页数：5

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