Numerical Analysis of Thermal Runaway in Copper-Plated Multifilament Coated Conductor

被引：2
作者：
Shen, Jingyu [1 ,2 ]
Sogabe, Yusuke [1 ]
Amemiya, Naoyuki [1 ]
机构：
[1] Kyoto Univ, Dept Elect Engn, Kyoto 6158510, Japan
[2] Xi An Jiao Tong Univ, Sch Elect Engn, Xian 710049, Peoples R China
来源：
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2023年 / 33卷 / 05期
关键词：
Coated conductor; copper plating; current-sharing; multifilament; thermal runaway;
D O I：
10.1109/TASC.2023.3244146
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We have developed a numerical analysis model to simulate the thermal runaway in copper-plated multifilament coated conductors. We combined a circuit model to calculate current distribution in filaments and copper and a two-dimensional heat conduction model to calculate temperature distribution. The thermal runaway simulations of multifilament coated conductor with local defects were performed, and compared with the experimental results to validate the developed model. According to the simulation results, the effect of current sharing on the initiation of thermal runaway was determined.
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页数：5
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