Overcoming Planar Phased Array Circuit Design Challenges

被引：0

作者：

Dobler, Joel ^{[1
]}

Ringwood, Sam ^{[1
]}

机构：

[1] Analog Devices Inc, Wilmington, MA 01887 USA

来源：

MICROWAVE JOURNAL | 2023年 / 66卷 / 03期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This article details the design and layout challenges associated with the electronic design of planar phased arrays and focuses on an RF front-end containing power amplifliers (PAs), low noise amplifliers (LNAs) and beamformers. The printed circuit board (PCB) layout discussion highlights a single cell, consisting of a beamformer surrounded by four transmit/receive (Tx/Rx) modules. Thermal management challenges are discussed, including component side heat sinking and heat sink cavity design with RF absorbers to avoid oscillations.

引用

页码：48 / 56

页数：9