Degradation Mechanisms of Gate Leakage in GaN-Based HEMTs at Low Dose Rate Irradiation

被引:1
|
作者
Li, Xiaolong [1 ]
Wang, Xin [1 ]
Liu, Mohan [1 ]
Zhu, Kunfeng [2 ]
Shui, Guohua [2 ]
Zheng, Qiwen [1 ]
Cui, Jiangwei [1 ]
Lu, Wu [1 ]
Li, Yudong [1 ]
Guo, Qi [1 ]
机构
[1] Chinese Acad Sci, Xinjiang Tech Inst Phys & Chem, Key Lab Funct Mat & Devices Special Environm, Urumqi 830011, Peoples R China
[2] Sci & Technol Analog Integrated Circuit Lab, Chongqing 400000, Peoples R China
来源
IEEE ACCESS | 2024年 / 12卷
基金
中国国家自然科学基金;
关键词
Logic gates; HEMTs; MODFETs; Radiation effects; Degradation; Transconductance; Gate leakage; Gallium nitride; Leakage currents; p-GaN high-electron-mobility transistor (HEMT); low dose rate irradiation; gate leakage; ALGAN/GAN; DEPENDENCE;
D O I
10.1109/ACCESS.2024.3368870
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we investigated an experimental analysis of the degradation caused by low dose rate irradiation in GaN-based high-electron-mobility transistors (HEMTs) with a p-type gate. Combined with experimental frequency-dependent conductance ( G(p)/omega) analyses and TCAD simulations, it has been demonstrated that the negative shifts in both I-d - V-gs and V-th are primarily due to the formation of donor-like traps near the p-GaN/AlGaN interface, which is a result of the dehydrogenation of pre-existing defects during low dose rate irradiation. Additionally, the results of the TCAD simulations, indicate that the trap-assisted tunneling (TAT) process, which involves the recombination of trap-assisted holes with electrons in the p-GaN layer, may dominate the physical mechanisms responsible for the increase in gate leakage current ( I-g -V-gs ). These results may provide a basis for understanding the role of radiation-induced traps on electrical parameters degradations for p-GaN gate HEMTs.
引用
收藏
页码:35410 / 35416
页数:7
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