共 27 条
[1]
Bozkurt A., 1993, P IEEE ULTRASONICS S, DOI [10.1109/ULTSYM.1993.339543, DOI 10.1109/ULTSYM.1993.339543]
[2]
Lock-In-Thermography, Photoemission, and Time-Resolved GHz Acoustic Microscopy Techniques for Nondestructive Defect Localization in TSV
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2018, 8 (05)
:735-744
[3]
Brand S, 2015, ELEC COMP C, P46, DOI 10.1109/ECTC.2015.7159570
[4]
Briggs A., 2010, Acoustic microscopy, V67
[5]
Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer selection
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
1999, 22 (04)
:582-592