Temperature-related tensile modulus of polymer-based adhesive films

被引：8

作者：

Kumpenza, Cedou ^{[1
]}

Pramreiter, Maximilian ^{[1
]}

Nenning, Tobias Josef ^{[1
]}

Bliem, Peter ^{[2
]}

Reiterer, Rainer ^{[3
]}

Konnerth, Johannes ^{[1
]}

Mueller, Ulrich ^{[1
]}

机构：

[1] Univ Nat Resources & Life Sci, Inst Wood Technol & Renewable Mat, Dept Mat Sci & Proc Engn, Vienna, Austria

[2] Kompetenzzentrum Holz GmbH, Wood K Plus Competence Ctr Wood Composites & Wood, Linz, Austria

[3] Collano AG, Sempach, Switzerland

来源：

JOURNAL OF ADHESION | 2023年 / 99卷 / 02期

关键词：

Adhesion; Elastic Modulus; Polymer adhesive; Temperature dependency; Wood hybrid components; STRAIN-RATE DEPENDENCE; MECHANICAL-PROPERTIES; ELASTIC PROPERTIES; WOOD; PERFORMANCE; MOISTURE;

D O I：

10.1080/00218464.2021.2011239

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Most engineered wood components and their performance are dependent on the use of adhesives. To be able to conduct simulations, a general understanding about their mechanical behaviour under different load cases and environmental conditions is needed. Especially the temperature-dependent elasticity is of great importance for future applications as automotive components. Therefore, the tensile modulus of four common polymer-based wood adhesives (i.e., one-component polyurethane, two-component polyurethane, epoxy-silan and phenol-resorcinol-formaldehyde) at varying temperatures of -30 degrees C, +20 degrees C and +80 degrees C were investigated. The aim of this study was to give fundamental insight into the elasto-mechanical behaviour of common wood adhesives. The experimental investigation showed a significant influence of the temperature on the tensile modulus. The highest tensile moduli were observed for all tested adhesives at -30 degrees C with a significant decrease with increasing temperature. Results of previous investigations confirmed this high-temperature dependency of the polymers.

引用

页码：259 / 276

页数：18

共 58 条

[1]

Al-Mosawe A., 2020, IOP Conference Series: Materials Science and Engineering, V671, DOI 10.1088/1757-899X/671/1/012104

[2] Synthesizing radiation-hard polymer and copolymers using laccol monomers extracted from lacquer tree toxicodendron succedanea via cationic polymerization [J].

Arachchilage, Imalka H. A. M. ;

Patel, Milly K. ;

Harmon, Julie P. .

POLYMER ENGINEERING AND SCIENCE, 2019, 59 (08) :1611-1623

[3]

Baumann G., 2019, ATZ Worldw., V121, P48

[4]

Biron M., 2013, THERMOSETS COMPOSITE

[5] PHYSICAL ASPECTS OF WOOD ADHESIVE BOND FORMATION WITH FORMALDEHYDE BASED ADHESIVES .1. THE EFFECT OF CURING CONDITIONS ON THE PHYSICAL-PROPERTIES OF UREA FORMALDEHYDE FILMS [J].

BOLTON, AJ ;

IRLE, MA .

HOLZFORSCHUNG, 1987, 41 (03) :155-158

[6]

Brinson HF, 2008, Polymer engineering science and viscoelasticity: an introduction, DOI [10.1007/978-0-387-73861-1_3, DOI 10.1007/978-1-4899-7485-3]

[7]

Chen K.S., 2010, MEMS RESIDUAL STRESS, Vc, DOI [10.1016/B978-0-8155-1594-4.00018-8, DOI 10.1016/B978-0-8155-1594-4.00018-8]

[8] Influence of the filler material on the thermal stability of one-component moisture-curing polyurethane adhesives [J].

Clauss, Sebastian ;

Dijkstra, Dirk J. ;

Gabriel, Joseph ;

Karbach, Alexander ;

Matner, Mathias ;

Meckel, Walter ;

Niemz, Peter .

JOURNAL OF APPLIED POLYMER SCIENCE, 2012, 124 (05) :3641-3649

[9]

Collano A.G., DATASHEET 2C PUR

[10]

Collano A.G., DATASHEET EP SI

← 1 2 3 4 5 6 →