Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding

被引：9
作者：
Kang, Qiushi [1 ]
Li, Ge [1 ]
Li, Zhengda [1 ]
Tian, Yanhong [1 ]
Wang, Chenxi [1 ]
机构：
[1] Harbin Inst Technol, Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY | 2023年 / 149卷
基金：
中国国家自然科学基金;
关键词：
CU; PASSIVATION; BEHAVIOR; FILMS;
D O I：
10.1016/j.jmst.2022.12.012
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Silica
引用
收藏
页码：161 / 166
页数：6
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