A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

被引：7
作者：
Li, Yilin [1 ]
Yu, Shuyuan [2 ]
Li, Liangwei [1 ]
Song, Shijie [1 ]
Qin, Weiou [1 ]
Qi, Da [1 ]
Yang, Wenchao [1 ]
Zhan, Yongzhong [1 ]
机构：
[1] Guangxi Univ, Sch Resources, State Key Lab Featured Met Mat & Life Cycle Safety, MOE Key Lab New Proc Technol Nonferrous Met & Mat, Nanning 530004, Peoples R China
[2] Shenzhen Customs Ind Prod Testing Technol Ctr, Shenzhen 518067, Peoples R China
来源：
METALS | 2023年 / 13卷 / 07期
基金：
中国国家自然科学基金;
关键词：
graphene; lead-free solder; particle reinforcement; composite solder; strengthening mechanisms; preparation method; INTERMETALLIC COMPOUND GROWTH; AG-CU SOLDERS; MECHANICAL-PROPERTIES; NANOSHEETS ADDITION; INTERFACE REACTION; SHEAR-STRENGTH; MICROSTRUCTURE; WETTABILITY; PERFORMANCE; JOINTS;
D O I：
10.3390/met13071209
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.
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页数：23
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