Customizable Supercapacitors via 3D Printed Gel Electrolyte

被引:8
|
作者
Liu, Dongna [1 ,2 ,3 ,4 ]
Wang, Zhaoyang [5 ,6 ]
Qian, Qilin [7 ]
Wang, Jizhe [2 ,3 ,4 ]
Ren, Jingbo [2 ,3 ,4 ]
Chen, Hehao [2 ,3 ,4 ]
Xing, Wang [8 ]
Zhou, Nanjia [2 ,3 ,4 ]
机构
[1] Zhejiang Univ, Sch Mat Sci & Engn, Hangzhou 310027, Zhejiang, Peoples R China
[2] Westlake Univ, Res Ctr Ind Future, Key Lab Micro Nano Fabricat & Characterizat Zheji, Hangzhou 310024, Zhejiang, Peoples R China
[3] Westlake Univ, Sch Engn, Hangzhou 310024, Zhejiang, Peoples R China
[4] Westlake Inst Adv Study, Inst Adv Technol, Hangzhou 310024, Zhejiang, Peoples R China
[5] Hubei Engn Univ, Sch Chem & Mat Sci, Wuhan 432000, Hubei, Peoples R China
[6] Wuhan Univ Technol, Int Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
[7] Hangzhou Dianzi Univ, Sch Elect & Informat, Hangzhou 310018, Peoples R China
[8] Zhejiang Univ City Coll, Sch Engn, Adv Mat Addit Mfg Res & Innovat Ctr, Hangzhou 310015, Peoples R China
基金
中国国家自然科学基金;
关键词
3D printed electrolytes; customizable architectures; structural supercapacitors; ALL-SOLID-STATE; IONIC LIQUIDS; MICRO-SUPERCAPACITORS; ENERGY-STORAGE; IONOGELS; CHIP;
D O I
10.1002/adfm.202214301
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
New manufacturing strategies toward customizable energy storage devices (ESDs) are urgently required to allow structural designability for space and weight-sensitive electronics. Besides the macroscopic geometry customization, the ability to fine-tune the ESD internal architectures are key to device optimization, allowing short and uniform electrons/ions diffusion pathways and increased contact areas while overcoming the issues of long transport distance and high interfacial resistance in conventional devices with planar thick electrodes. ESDs with 2D or 3D electrodes filled with liquid or gel-like electrolyte have been reported, yet they face significant challenges in design flexibility for 3D ESD architectures. Herein, a novel method of assembling ESDs with the ability to customizing both external and internal architectures via digital light processing (DLP) technique and a facile sequential dip-coating process is demonstrated. Using supercapacitors as prototype device, the 3D printing of ESDs with areal capacity of 282.7 mF cm(-2) which is higher than a reference device with same mass loading employing planar stacked configuration (205.5 mF cm(-2)) is demonstrated. The printed devices with highly customizable external geometry conveniently allow the ESDs to serve as structural components for various electronics such as watchband and biomimetic electronics which are difficult to be manufactured with previously reported strategies.
引用
收藏
页数:8
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