Negative thermal expansion materials show great potential in brazing field, which is used to compensate high thermal expansion of metal fillers. However, the limited content and agglomeration have always been the key problems restricting its development. Herein, a novel strategy is developed by constructing a three-dimensional (3D) Sc2W3O12 interpenetrating network structure. With the help of 3D network interlayer, the Sc2W3O12 materials are evenly distributed in the brazing seam and the volume fraction is increased to 20%. From the finite element analysis results, the residual stress in X directions is decreased from 475/-400 MPa to 367/-358 MPa. After introduced the Sc2W3O12 network interlayer, the maximum shear strength is about 96 MPa, which is 1.3 times that of the joint without network structure and 4 times that of the joint directly brazed by AgCuTi. In this study, a new method to improve the application of reinforced phases is proposed, which provides a new method for the development of NTE materials reinforced metal composites.
机构:
Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Yangzhou Univ, Microelect Ind Res Inst, Yangzhou, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Fan, Xiaoxue
Zhang, Zhiping
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Yangzhou Univ, Guangling Coll, Yangzhou, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Zhang, Zhiping
Liu, Hongfei
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机构:
Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Yangzhou Univ, Microelect Ind Res Inst, Yangzhou, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
机构:
Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Yangzhou Univ, Microelect Ind Res Inst, Yangzhou 225002, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Liu, Hongfei
Fan, Xiaoxue
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机构:
Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Fan, Xiaoxue
Wang, Wei
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机构:
Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Yangzhou Univ, Microelect Ind Res Inst, Yangzhou 225002, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Wang, Wei
Zeng, Xianghua
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Yangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China
Zeng, Xianghua
Zhang, Zhiping
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机构:
Yangzhou Univ, Guangling Coll, Yangzhou 225000, Peoples R China
Yangzhou Univ, Microelect Ind Res Inst, Yangzhou 225002, Peoples R ChinaYangzhou Univ, Sch Phys Sci & Technol, Yangzhou 225002, Peoples R China