Design of a W-band High-PAE Class A & AB Power Amplifier in 150 nm GaAs Technology

被引:2
作者
Lee, Jun Yan [1 ,2 ]
Wu, Duo [2 ]
Guo, Xuanrui [2 ,3 ]
Ariannejad, Mohammadmahdi [2 ]
Bhuiyan, Mohammad Arif Sobhan [2 ]
Miraz, Mahdi H. [4 ,5 ,6 ]
机构
[1] Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Shanghai, Peoples R China
[2] Xiamen Univ Malaysia, Dept Elect & Elect Engn, Sepang, Malaysia
[3] Delft Univ Technol, Dept Microelect, Delft, Netherlands
[4] Xiamen Univ Malaysia, Sch Comp & Data Sci, Sepang, Malaysia
[5] Wrexham Glyndwr Univ, Fac Arts Sci & Technol, Wrexham, Wales
[6] Univ South Wales, Fac Comp Engn & Sci, Swansea, Wales
关键词
6G; GaAs; Power amplifier; PAE; Capacitive biased; W-band; Transceiver; Sub-THz; COMMUNICATION;
D O I
10.1007/s42341-024-00513-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Nanometer scale power amplifiers (PA) at sub-THz suffer from severe parasitic effects that lead to experience limited maximum frequency and reduced power performance at the device transceiver front end. The integrated circuits researchers proposed different PA design architecture combinations at scaled down technologies to overcome these limitations. Although the designs meet the minimum requirements, the power added efficiency (PAE) of PA is still quite low. In this paper, a W-band single-ended common-source (CS) and cascode integrated 3-stage 2-way PA design is proposed. The design integrated different key design methodologies to mitigate the parasitic; such as combined Class AB and Class A stages for gain-boosting and efficiency enhancement, Wilkinson power combiner for higher output power, linearity, and bandwidth, and transmission line (TL)-based wide band matching network for better inter-stage matching and compact size. The proposed PA design is validated using UMS 150-nm GaAs pHEMT using advanced design system (ADS) simulator. The results show that the proposed PA achieved a gain of 20.1 dB, an output power of 17.2 dBm, a PAE of 33% and a 21 GHz bandwidth at 90 GHz Sub-THz band. The PA layout consumes only 5.66 x 2.51 mm2 die space including pads. Our proposed PA design will boost the research on sub-THz integrated circuits research and will smooth the wide spread adoption of 6G in near future.
引用
收藏
页码:304 / 313
页数:10
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