Analysis and Design of Multi-Stacked FET Power Amplifier With Phase-Compensation Inductors in Millimeter-Wave Band

被引:12
作者
Kim, Kyunghwan [1 ]
Choi, Inho [1 ]
Lee, Kangseop [1 ]
Choi, Seung-Uk [1 ]
Kim, Jiseul [1 ]
Choi, Chan-Gyu [1 ]
Song, Ho-Jin [1 ]
机构
[1] Pohang Univ Sci & Technol, Dept Elect Engn, Pohang 37673, South Korea
关键词
CMOS; F-band; millimeter-wave (mm-wave); power amplifier (PA); stacked FET; OUTPUT POWER; GHZ;
D O I
10.1109/TMTT.2022.3232167
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Stacked-FET topology is analyzed to increase the output power of a power amplifier (PA) in the millimeter-wave (mm-wave) band. In the mm-wave band, parasitic capacitances of the transistor severely degrade stacking efficiency due to the phase mismatch between stacked FETs. The phase-compensation (PC) inductances, including the losses of the inductor for the best stacking efficiency, are presented in both series and shunt connections. From this analysis, a triple-stacked-FET PA is designed in the F-band. Proper PC series or shunt inductor types are used between the first and second stacked FETs and between the second and third stacked FETs in consideration of the core layout and inductor size. The PA is fabricated in the 28-nm CMOS fully depleted silicon-on-insulator (FD-SOI) process. With a compact core area of 0.054 mm2, the PA achieves peak PSAT and PAEMAX of 15.1 dBm and 18.6%, respectively.
引用
收藏
页码:1877 / 1889
页数:13
相关论文
共 43 条
  • [1] Multi-Drive Stacked-FET Power Amplifiers at 90 GHz in 45 nm SOI CMOS
    Agah, Amir
    Jayamon, Jefy Alex
    Asbeck, Peter M.
    Larson, Lawrence E.
    Buckwalter, James F.
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2014, 49 (05) : 1148 - 1157
  • [2] Ahmed F, 2016, EUR MICROW INTEGRAT, P257, DOI 10.1109/EuMIC.2016.7777539
  • [3] A Stacked Segmented Adaptive Power Amplifier in 22nm FD-SOI
    Banerjee, Aritra
    van Liempd, Barend
    Wambacq, Piet
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2022, 32 (08) : 983 - 986
  • [4] A Review of Technologies and Design Techniques of Millimeter-Wave Power Amplifiers
    Camarchia, Vittorio
    Quaglia, Roberto
    Piacibello, Anna
    Nguyen, Duy P.
    Wang, Hua
    Pham, Anh-Vu
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2020, 68 (07) : 2957 - 2983
  • [5] A Fully integrated D-band Direct-Conversion I/Q Transmitter and Receiver Chipset in SiGe BiCMOS Technology
    Carpenter, Sona
    Zirath, Herbert
    He, Zhongxia Simon
    Bao, Mingquan
    [J]. JOURNAL OF COMMUNICATIONS AND NETWORKS, 2021, 23 (02) : 73 - 82
  • [6] A Compact 140-GHz CMOS Power Amplifier With 10.5-dBm Output Power and 27.6-dB Power Gain Supporting up to 128-QAM Modulation
    Chen, Liang
    Zhang, Lei
    Wu, Weiping
    Wang, Yan
    [J]. IEEE SOLID-STATE CIRCUITS LETTERS, 2022, 5 : 214 - 217
  • [7] A 25.5-dB Peak Gain F-Band Power Amplifier With an Adaptive Built-In Linearizer
    Cho, Gwangsik
    Park, Jinseok
    Hong, Songcheol
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2020, 30 (01) : 106 - 108
  • [8] D-Band and G-Band High-Performance GaN Power Amplifier MMICs
    Cwiklinski, Maciej
    Brueckner, Peter
    Leone, Stefano
    Friesicke, Christian
    Mabler, Hermann
    Lozar, Roger
    Wagner, Sandrine
    Quay, Ruediger
    Ambacher, Oliver
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2019, 67 (12) : 5080 - 5089
  • [9] Analysis and Design of Stacked-FET Millimeter-Wave Power Amplifiers
    Dabag, Hayg-Taniel
    Hanafi, Bassel
    Golcuk, Fatih
    Agah, Amir
    Buckwalter, James F.
    Asbeck, Peter M.
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2013, 61 (04) : 1543 - 1556
  • [10] High-Power Generation for mm-Wave 5G Power Amplifiers in Deep Submicrometer Planar and FinFET Bulk CMOS
    Daneshgar, Saeid
    Dasgupta, Kaushik
    Thakkar, Chintan
    Chakrabarti, Anandaroop
    Levy, Cooper S.
    Jaussi, James E.
    Casper, Bryan
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2020, 68 (06) : 2041 - 2056