Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate

被引：0

作者：

Hu, Tianhan ^{[1
]}

Li, Zhen ^{[1
]}

Wu, Guanzhi ^{[1
]}

Li, Shun ^{[1
]}

Ding, Kai ^{[1
]}

Gao, Yulai ^{[1
,2
]}

机构：

[1] Shanghai Univ, Ctr Adv Solidificat Technol, Sch Mat Sci & Engn, State Key Lab Adv Special Steel, 99 Shangda Rd, Shanghai 200444, Peoples R China

[2] Shanghai Univ, Shanghai Engn Res Ctr Met Parts Green Remanufactur, 99 Shangda Rd, Shanghai 200444, Peoples R China

来源：

MATERIALS PERFORMANCE AND CHARACTERIZATION | 2023年 / 12卷 / 01期

基金：

中国国家自然科学基金;

关键词：

Sn-Bi-Ag-In; lead-free solder; wettability; intermetallic compound; powder size; MECHANICAL-PROPERTIES; SN-58BI SOLDER; BEHAVIOR; STRENGTH; JOINTS; ALLOY; INTERFACE; GROWTH;

D O I：

10.1520/MPC20230003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, tin-bismuth-silver-indium (Sn-Bi-Ag-In) lead-free solder powders are prepared by the consumable-electrode direct current arc (CDCA) method. Without agglomeration, the satellite-free solder powders show good sphericity. The effect of solder powder sizes on the wettability and microstructure of Sn-Bi-Ag-In solder alloy on copper substrate is systemati-cally investigated. The solder joints prepared by solder powder in a size of 53-120 mu m exhibit relatively small wetting angles. In addition, the microstructure of the solder joints is com-posed of bismuth-rich phases, tin-rich phases, and Ag3Sn phases. A continuous intermetallic compound (IMC) layer with a thickness in the range of 0.64-0.70 mu m is formed at the inter-face between the solder and the copper substrate. The results show that the formation and morphology variety of the IMC layers for different solder joints are unobvious, reflecting the good wettability of the Sn-Bi-Ag-In lead-free solder powders on the copper substrate in a wide size range.

引用

页码：117 / 128

页数：13

共 47 条

[1] Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy [J].