Electrical and Mechanical Behavior of Aerosol Jet-Printed Gold on Alumina Substrate for High-Temperature Applications

被引:3
|
作者
Alshatnawi, Firas [1 ,2 ]
Alhendi, Mohammed [2 ]
Abbara, El Mehdi [1 ,2 ]
Sivasubramony, Rajesh [1 ,2 ]
Garakani, Behnam [3 ]
Enakerakpo, Emuobosan [1 ,2 ]
Shaddock, David [4 ]
Stoffel, Nancy [4 ]
Hoel, Cathleen [4 ]
Poliks, Mark D. [1 ,2 ,3 ]
Borgesen, Peter [1 ,3 ]
机构
[1] Binghamton Univ, Dept Syst Sci & Ind Engn, Vestal, NY 13902 USA
[2] Binghamton Univ, Ctr Adv Microelect Mfg CAMM, Vestal, NY 13902 USA
[3] Binghamton Univ, Mat Sci & Engn Program, Binghamton, NY 13902 USA
[4] GE Res Ctr, One Res Circle, Niskayuna, NY 12309 USA
关键词
aerosol jet printing; ceramics; electronics packaging; high-temperature electronics; materials characterization; reliability testing; thick films; ELECTROCHEMICAL MIGRATION; THIN-FILMS; ELECTRONICS; TRANSISTORS; COPPER; RESISTANCE; ADHESION;
D O I
10.1002/adem.202300439
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 & DEG;C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high-temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 & DEG;C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 & DEG;C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 & DEG;C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.
引用
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页数:10
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