Sustainable application of biodegradable materials for thermal shield in electronic devices

Adaptation of biodegradable materials for packaging electronic devices have attracted a lot of accolades in recent times considering the functionality of the electronic devices in multidimensional applications. Polymer-based packaging materials are discussed in this paper highlighting existing materials being used amidst rising envi-ronmental impact. Part of the details of this paper is to discuss the potential of polymer-based electronic packaging material with emphasis on their comparative advantage, taking into consideration several components accumulating into these substrate materials. Electronic devices, being conductive in nature, require a sustainable dielectric material as thermal interface between the devices and packaging material. This may, however, require, treatment of polymer-based materials, like the surface treatment of fibre, and morphological analysis of polymer microstructures before they are deployed for these applications. The paper also dwells on the future directions of biodegradable materials in the face of uncertain future. This necessitates the call to understudy the water retention capability of biodegradable materials ahead of being profiled for any application. Future prospects and opportunities on inorganic material are X-rayed as way of reducing pressure on nature and biodiversity.