Investigations on thermal contact resistance between filled polymer composites and solids using micro thermography

被引:1
作者
Roser, Oliver [1 ,3 ]
Griesinger, Andreas [2 ,3 ]
Marti, Othmar [1 ]
机构
[1] Univ Ulm, Inst Expt Phys, D-89081 Ulm, Baden Wurttembe, Germany
[2] Baden Wuerttemberg Cooperat State Univ DHBW, D-70197 Baden Baden, Baden Wurttembe, Germany
[3] Ctr Heat Management ZFW, D-70174 Stuttgart, Baden Wurttembe, Germany
关键词
thermal contact resistance; filled polymers; TIM junctions; micro thermography; microscale TCR; SILICONE-RUBBER; PARTICLE-SHAPE; CONDUCTIVITY; CONDUCTANCE; AL2O3;
D O I
10.1088/1361-6501/acec8f
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This article reports the use of a new measurement technique based on micro thermography for determining the thermal contact resistances (TCRs) between filled polymers and solids. The thermal conductivity of polymers can be significantly increased by using thermally conductive fillers. For numerous applications, not only is a high intrinsic thermal conductivity required but also a good thermal transfer between the filled polymer and an adjacent solid surface. The physical principles of thermal transport when considering this type of contact have not yet been investigated in detail, and only a few experimental results are available. The most common measurement techniques determine a macroscopic resistance and project it onto the contacting surface. However, the heterogeneous microstructure of a filled polymer causes the TCR to be a volumetric phenomenon in the overall boundary region. The utilized IR camera system takes thermal images with a spatial resolution of less than 15 mu m
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页数:17
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