Design and performance research of integrated indirect liquid cooling system for rack server

The development of emerging technologies such as Internet of things, blockchain, and artificial intelligence put forward higher requirements for the computing power of edge data center servers, which is mainly restricted by cooling technology. To improve the heat dissipation performance and the deployment flexibility of the edge data center, the concept of integrated indirect liquid cooling system for the edge data center server was introduced, and two samples were investigated through the tests. Firstly, the factors affecting the system performance were studied by experiment and numerical simulation. Then, the heat transfer performance, the flow characteristic, and the system's stability were analyzed. Finally, the temperature control ability of the air cooling and liquid cooling server was compared and analyzed by numerical simulation method. The results show that increasing the flow rate improves the heat dissipation performance when the surface temperature and thermal resistance of the chip reduce. But the further increase in flow rate slows down this trend. The heat dissipation performance of the system also reduces with the increase in coolant temperature. Two sets of the cooling systems, which are respectively arranged inside and outside the server, have similar flow characteristics, but the feasibility of the external system server is higher, which is verified by the numerical simulation method.