Flow boiling heat transfer enhancement in vertical minichannel heat sink with non-uniform microcavity arrays under electric field

被引:15
作者
Li, Tengfei [1 ]
Luo, Xiaoping [1 ]
He, Bolin [1 ]
Wang, Liangfeng [1 ]
Zhang, Jinxin [1 ]
Liu, Qian [1 ]
机构
[1] South China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
基金
中国国家自然科学基金;
关键词
Minichannel; Micro -concave cavity; Electrohydrodynamic; Heat transfer enhancement; Nanofluid; PRESSURE-DROP; FLUX; CONDENSATION; REFRIGERANT; PERFORMANCE; NANOFLUID; SURFACES; TUBE;
D O I
10.1016/j.expthermflusci.2023.110997
中图分类号
O414.1 [热力学];
学科分类号
摘要
Effects of electrohydrodynamics (EHD) on the bubble behavior and enhanced heat dissipation mechanism for four surface configurations and various heat fluxes in an upward flowing minichannel heat sink were studied experimentally. Three different minichannel configurations with microcavities array were fabricated using direct metal laser sintering. Flow boiling experiments of nanofluid (SiO2-R141b) under different nonuniform electric fields were performed. Homogeneity test of Variance Analysis was introduced to analyze the effect of design and operation parameters on heat transfer. Coupled effect of microcavity and electric field was further found to improve boiling heat transfer efficiency. Visualization shows that the diameter of small bubbles leaving microcavity increased under electric field. The bubbles wiggled between wire electrode and heated wall by action of electric field in bubbly flow district. Furthermore, the mechanism of perturbation of small bubbles flowing along the heating wall under electric field was discussed. It was revealed that the micro-concave cavity array distributed dense downstream and sparse upstream had a large impact on heat transfer coefficient (HTC), especially under electric field. The maximum synthetic enhancement factor of 2.11 was obtained for given flow conditions. Furthermore, a new predictive equation was proposed by a nonlinear regression equation to consider the effects of micro-concave cavity distribution and electric field factors on thermal transfer performance, and this correlation can predict the HTC affected by non-uniform micro-concave arrays well within the & PLUSMN; 10% error band.
引用
收藏
页数:19
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