An E-plane horn antenna fed with E-plane Tee junction conceptualized by SIW technology

被引:0
作者
Choudhury, Suvadeep [1 ,2 ,4 ]
Mohan, Akhilesh [3 ]
机构
[1] Univ Pisa, Dipartimento Ingn Informaz, Pisa, Italy
[2] LNMIIT, Dept Elect & Commun Engn, Jaipur, India
[3] IIT Roorkee, Dept Elect & Commun Engn, Roorkee, Uttarakhand, India
[4] Univ Pisa, Dipartimento Ingn Informaz, I-56122 Pisa, Italy
关键词
E-plane horn; glueless; horn antenna; SIW horn; substrate integrated waveguide;
D O I
10.1002/mop.33804
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel E-plane horn antenna fed with E-plane Tee junction, conceptualized using the substrateintegrated waveguide (SIW) technology is introduced and investigated. Conventional SIW-inspired horn designs are mostly limited to H-plane sectoral horns, portraying confined radiation along the H-plane while unconfined, fan-beam-shaped radiation along the principal E-plane. Such radiation characteristics restrict its usage to designs requiring an electric field parallel to the structure and ultimately narrow confined radiation along the principal E-plane of the embodiment. The proposed design provides a glue-less solution to designing an E-plane horn fed by an E-plane Tee junction, both conceptualized by the SIW technology, having relative ease of fabrication on dual copper clad Printed Circuit Boards. Such a design operates from 17.15 to 18.8 GHz (similar to 9.2% operating bandwidth) with a realized gain greater than 10.5 dBi, making it suitable for applications requiring light-weighted high-gain E-plane sectoral horn antennas.
引用
收藏
页码:2933 / 2940
页数:8
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