STABILIZERS OF SOLUTIONS OF CHEMICAL COPPER PLATING

被引:0
|
作者
Solopchuk, Mariya S. [1 ]
Grigoryan, Nelya S. [1 ]
Asnis, Naum A. [1 ]
Vagramyan, Tigran A. [1 ]
Shmelkova, Polina O. [1 ]
Bardina, Olga I. [1 ]
机构
[1] Mendeleev Univ Chem Technol, Dept Innovat Mat & Corros Protect, Miusskaya sq, 9, Moscow 125047, Russia
关键词
printed circuit boards; electroless copper plating solution; solution stability; stabilizers; THIN-FILM; ADDITIVES;
D O I
10.6060/ivkkt.20236603.6708
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The work is devoted to the study of the effect of various compounds on the stability of elec-troless copper plating solution containing Trilon B. as a chelating agent. The stability of electroless copper plating solutions was estimated by the accelerated method as the time before the start of intensive decomposition of the solution after the introduction of 0.15 ml of colloidal palladium activator solution heated to 75 degrees C in 250 ml. As stabilizers, both known, currently used, and newly selected compounds were investigated. Sulfur-and/or nitrogen-containing organic and inorganic compounds such as: sodium diethyldithiocarbamate, 2,2'-dipyridyl, thiosemicarbazide, potassium hexacyanoferrate (III), potassium hexacyanoferrate (II), thiourea, thioglycolic acid, dimethylgly-oxime, potassium rhodanide in concentrations in the range of 1 -50 mu mol/l were among the first studied. It is shown that when the stabilizers are contained in the solution at the optimal concen-trations set (for each compound), solutions containing sodium diethyldithiocarbamate, thioglycolic acid, thiosemicarbazide, thiourea (in descending order of stabilizing action), i.e. compounds con-taining a sulfur-carbon bond, have the greatest stability. With this in mind, other sulfur-containing compounds, including heterocyclic ones, were selected and studied as stabilizers: alpha-lipoic acid, thi-amine chloride, methyl orange, nitroso-p-salt, methylene blue and SPADNS (sodium salt of 2- (psulfophenylazo)-1,8- dihydroxynaphthalene-3,6-disulfonic acids). In addition, nitrogen -contain-ing compounds that were not previously used in electroless copper plating solutions as stabilizers were also studied: nicotine, pyridoxine, Janus Green B (8-(4-dimethylaminophenyl) diazenyl-N, N-diethyl-10-phenylphenazine-10-ium-2-amine chloride), nigrosine, however. Solutions of electro-less copper plating in the presence of these compounds did not show high stability. It has been established that the most effective, comparable in effect to the stabilizers currently used, are alpha-lipoic acid and thiamine chloride. The advantages of the latter are their availability and low toxicity.
引用
收藏
页码:100 / 107
页数:8
相关论文
共 50 条
  • [31] DEVELOPMENT OF CHEMICAL SENSORS FOR IONS IN PLATING SOLUTIONS
    CHEN, CJ
    SAVINELL, RF
    LIU, CC
    REID, S
    PLATING AND SURFACE FINISHING, 1989, 76 (06): : 74 - 78
  • [32] STABILITY OF CHEMICAL SILVER-PLATING SOLUTIONS
    FOFANOV, GM
    EVSEEVA, MA
    KITAEV, GA
    KORKUNOVA, TK
    PROTECTION OF METALS, 1979, 15 (01): : 100 - 102
  • [33] INORGANIC INHIBITORS IN SOLUTIONS FOR CHEMICAL COBALT PLATING
    BELINSKI, E
    KOSYUK, I
    VAITSEN, U
    BELINSKA, A
    PSHILUSKI, Y
    PROTECTION OF METALS, 1993, 29 (06): : 789 - 791
  • [34] Electrochemical behavior of nonstoichiometric copper sulfide in nickel and copper plating solutions
    Vinkyavichyus, I
    Mozhginskene, I
    Zhelene, A
    Pilite, S
    RUSSIAN JOURNAL OF APPLIED CHEMISTRY, 1997, 70 (12) : 1900 - 1904
  • [35] Application of saccharose as copper(II) ligand for electroless copper plating solutions
    Norkus, Eugenijus
    Prusinskas, Kestutis
    Vaskelis, Algirdas
    Jaciauskiene, Jane
    Stalnioniene, Irena
    Macalady, Donald L.
    CARBOHYDRATE RESEARCH, 2007, 342 (01) : 71 - 78
  • [36] CATALYTIC ACTIVITY OF COPPER IN ACID CHEMICAL NICKEL PLATING SOLUTIONS WITH ADDITION OF NH4CL
    PRUSOV, YV
    FLEROV, VN
    EPIFANOVA, VS
    SOVIET ELECTROCHEMISTRY, 1979, 15 (12): : 1565 - 1567
  • [37] Immersion plating of copper on porous silicon in various solutions
    Ogata, YH
    Sasano, J
    Jorne, J
    Tsuboi, T
    Harraz, FA
    Sakka, T
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 2000, 182 (01): : 71 - 77
  • [38] ACCUMULATION OF BY-PRODUCTS IN ELECTROLESS COPPER PLATING SOLUTIONS
    COURDUVELIS, CI
    SUTCLIFFE, G
    PLATING AND SURFACE FINISHING, 1980, 67 (09): : 71 - 75
  • [39] ELECTROCHEMICAL CORRECTION OF A CHEMICAL COPPER PLATING SOLUTION.
    Kitaev, G.A.
    Evseeva, M.A.
    Kononov, Yu.A.
    Shostak, S.M.
    Protection of Metals (English translation of Zaschita Metallov), 1987, 23 (02): : 248 - 250
  • [40] PREPARING THE PLASTICS SURFACE PRIOR TO CHEMICAL COPPER PLATING
    YUDINA, TF
    PYATACHKOVA, TV
    KRIVTSOV, AK
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, 1989, 32 (03): : 60 - 62