Estimation of Both Junction Temperature and Load Current of IGBTs from Output Voltage of Gate Driver

被引:0
作者
Yamasaki, Hiromu [1 ]
Hata, Katsuhiro [1 ]
Takamiya, Makoto [1 ]
机构
[1] Univ Tokyo, 4-6-1 Komaba,Meguro Ku, Tokyo 1538505, Japan
关键词
digital gate driver; IGBT; junction temperature; load current; estimation; SENSITIVE ELECTRICAL PARAMETER;
D O I
10.1541/ieejjia.22007728
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For the online condition monitoring of IGBTs, a new estimation method of both the junction temperature (TJ) and the load current (IL) of IGBTs using a momentary high-Z gate driving (MHZGD) from the output voltage (VOUT) of the gate driver is proposed, which can be integrated into the gate driver ICs. TJ is estimated from VOUT difference during and after the MHZGD period, and IL is estimated from VOUT during MHZGD. In the 110 switching measurements at 11 different TJ's from 25 degrees C to 125 degrees C and 10 different IL's from 12.5 A to 80 A for each of the three IGBTs, TJ and IL estimation errors in a low test cost parameter determination method are +4.9 degrees C/-8.4 degrees C and +1.1 A/-4.3 A, respec-tively. In contrast, TJ and IL estimation errors in a parameter determination method with small error are +4.9 degrees C/-8.1 degrees C and +1.0 A/-1.8 A, respectively.
引用
收藏
页码:392 / 400
页数:9
相关论文
共 18 条
[1]   Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters-A Review [J].
Avenas, Yvan ;
Dupont, Laurent ;
Khatir, Zoubir .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2012, 27 (06) :3081-3092
[2]   The Temperature Dependence of the Flatband Voltage in High-Power IGBTs [J].
Baker, Nick ;
Iannuzzo, Francesco .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2019, 66 (07) :5581-5584
[3]   IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current [J].
Baker, Nick ;
Dupont, Laurent ;
Munk-Nielsen, Stig ;
Iannuzzo, Francesco ;
Liserre, Marco .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (04) :3099-3111
[4]   IGBT Junction Temperature Measurement via Peak Gate Current [J].
Baker, Nick ;
Munk-Nielsen, Stig ;
Iannuzzo, Francesco ;
Liserre, Marco .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2016, 31 (05) :3784-3793
[5]  
Brandelero J., 2018, PROC INT C INTEGRATE, P1
[6]   A Smart IGBT Gate Driver IC With Temperature Compensated Collector Current Sensing [J].
Chen, Jingxuan ;
Zhang, Wei Jia ;
Shorten, Andrew ;
Yu, Jingshu ;
Sasaki, Masahiro ;
Kawashima, Tetsuya ;
Nishio, Haruhiko ;
Ng, Wai Tung .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2019, 34 (05) :4613-4627
[7]   Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum dIC/dt During Turn-OFF for High Power Trench Gate/Field-Stop IGBT Modules [J].
Chen, Yuxiang ;
Luo, Haoze ;
Li, Wuhua ;
He, Xiangning ;
Iannuzzo, Francesco ;
Blaabjerg, Frede .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (08) :6394-6404
[8]   Reliability Improvement of Power Converters by Means of Condition Monitoring of IGBT Modules [J].
Choi, Ui-Min ;
Blaabjerg, Frede ;
Jorgensen, Soren ;
Munk-Nielsen, Stig ;
Rannestad, Bjorn .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (10) :7990-7997
[9]   In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives [J].
Ji, Bing ;
Song, Xueguan ;
Cao, Wenping ;
Pickert, Volker ;
Hu, Yihua ;
Mackersie, John William ;
Pierce, Gareth .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2015, 30 (03) :1535-1543
[10]  
Liu JC, 2018, APPL POWER ELECT CO, P2813, DOI 10.1109/APEC.2018.8341416