Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices

Recently, the advantages of microchannel and micro pin-fin heat sinks for cooling have become clear. This study delves into the effects of hybrid designs on electronic chip cooling by combining microchannel and pin-fin patterns. The research contrasts the performance of a straight micro -channel heat sink (Case I), circular pin-fin (Case II), straight-circular pin-fin-straight (Case III), and oblique grooved straight-circular pin-fin-oblique grooved straight (Case IV). Results show that Case IV's Nu number reaches 61 at Re = 1250, surpassing Case I, Case II, and Case III by 517 %, 32 %, and 235 %, respectively. Case IV also has the highest pressure drop. The study calculates each Case's performance evaluation index (n), highlighting the balance between enhanced Nu numbers and pressure drops. Case IV's n is notably higher than Case II and Case III. To achieve a more uniform thermal distribution across the entire heat sink, the orientation of the oblique grooves is modified in Case IV, resulting in a new design labeled Case V. While Cases IV and V have similar Nusselt numbers, Case V's design ensures consistent temperature distribution, reducing hotspot risks on the chip.