Enhanced mechanical property through high-yield fabrication process with double laser scanning method in two-photon lithography

Two-photon lithography (TPL) is a representative fabrication process for micro 3D structures with a sub-micron fabrication resolution. As the TPL process is developed and commercialized, the TPL process requires higher process yield to be a considered reliable manufacturing technique for mass production. However, delamination is one of the main factors that reduce the yield of the TPL process. In this study, a double-step laser scanning method is proposed as a reliable high-yield TPS process to reduce the delamination effect. The method entails a simple process that polymerizes the initial interfacial layer between the structures and substrate twice. The additional laser scanning step induces a strong crosslinking in the polymer, and thereby preventing swelling and delamination. Furthermore, the effectiveness of the method is evaluated with large-scale microlens arrays. Although the process time is slightly increased, the process yield is significantly improved through the use of the double-step laser scanning method. Hence, the double-step laser scanning process can be employed as a reliable additive manufacturing process for various 3D microscale devices, and more importantly, it can be used to increase the manufacturing yield through the reduction of defects caused by surface delamination.