Ultrahigh-speed silicon-based modulators/photodetectors for optical interconnects

被引：1

作者：

Hu, Xiao ^{[1
,2
]}

Wu, Dingyi ^{[1
]}

Zhang, Hongguang ^{[1
]}

Chen, Daigao ^{[1
,2
]}

Wang, Lei ^{[1
,2
]}

Xiao, Xi ^{[1
,2
,3
]}

Yu, Shaohua ^{[1
,2
,3
]}

机构：

[1] Wuhan Res Inst Posts & Telecommun, Natl Informat Optoelect Innovat Ctr, Wuhan 430074, Peoples R China

[2] China Informat & Commun Technol Grp Corp CICT, State Key Lab Opt Commun Technol & Networks, Wuhan 430074, Peoples R China

[3] Peng Cheng Lab, Shenzhen 518055, Peoples R China

来源：

2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC | 2023年

基金：

中国国家自然科学基金;

关键词：

GERMANIUM PHOTODETECTOR;

D O I：

10.1364/OFC.2023.Th3B.2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present our recent progress on the silicon photonic devices for next-generation optical interconnects. The 300 Gbit/s silicon microring modulator, 200 Gbit/s Ge EAM and 408 Gbit/s Ge-Si photodetector with the highest bandwidth of 110 GHz are presented. Single-chip 1.6 Tbit/s silicon-based optical transceiver is also demonstrated.

引用

页数：3

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