A 2D route to 3D computer chips

被引：1

作者：

Roy, Tania ^{[1
]}

机构：

[1] Duke Univ, Dept Elect & Comp Engn, Durham, NC 27708 USA

来源：

NATURE | 2024年 / 625卷 / 7994期

关键词：

Engineering; Materials science; Technology;

D O I：

10.1038/d41586-023-03992-6

中图分类号：

O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];

学科分类号：

07 ; 0710 ; 09 ;

摘要：

Ultrathin materials have long been touted as a solution to the problems faced by the ever-growing semiconductor industry. Evidence that 3D chips can be built from 2D semiconductors suggests that the hype was justified.

引用

页码：249 / 250

页数：2

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