共 39 条
- [11] Kharin SN, 2000, P INT SYMP DISCH EL, V19, P278, DOI 10.1109/DEIV.2000.877304
- [12] Process development of low-cost AgNi and AgFe contact materials with no range of solid solubility [J]. MULTI-FUNCTIONAL MATERIALS AND STRUCTURES, PTS 1 AND 2, 2008, 47-50 : 873 - 876
- [13] Kubota H, 2013, AM J PHYS APPL, V1, P1
- [16] Logachev AA, 2014, INT SYM DISCH ELECTR, P225, DOI 10.1109/DEIV.2014.6961660
- [17] McBride J. W., 2012, Proceedings of the 26th International Conference on Electrical Contacts (ICEC 2012), P353, DOI 10.1049/cp.2012.0674
- [18] Effect of the thermal constant on temperature rise of silver palladium alloy contacts [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2007, E90C (07): : 1405 - 1411
- [20] Miyanaga K, 2011, IEICE T ELECTRON, VE94C, P1431, DOI [10.1587/transele.E94.C.1431, 10.1587/transele.E94.C1431]