Facile synthesis of functionalized boron nitride nanosheets for photo-cured 3D printing of high thermal conductive composites

被引:6
作者
Zhao, Yaxing [1 ]
Ban, Lulu [1 ]
Chen, Chen [1 ]
Yang, Binjie [1 ]
Zhang, Shuai [2 ]
Chen, Chao [2 ]
Cui, Zhengwei [3 ]
Liu, Ren [1 ]
Sang, Xinxin [1 ,4 ]
机构
[1] Jiangnan Univ, Sch Chem & Mat Engn, Key Lab Synth & Biol Colloids, Minist Educ, Wuxi, Peoples R China
[2] Hiwing Mat Ind Co Ltd, Suzhou, Peoples R China
[3] Jiangnan Univ, Jiangsu Key Lab Adv Food Mfg Equipment & Technol, Wuxi, Peoples R China
[4] Jiangnan Univ, Sch Chem & Mat Engn, Key Lab Synth & Biol Colloids, Minist Educ, Wuxi 214122, Peoples R China
关键词
apple polyphenols; direct ink writing; exfoliation and functionalization; hexagonal boron nitride; polymer composite; thermal conductivity; POLYMER COMPOSITES; MANAGEMENT; CHALLENGES;
D O I
10.1002/pc.27980
中图分类号
TB33 [复合材料];
学科分类号
摘要
Addressing the concern of heat accumulation in electronic devices, considerable research efforts have been dedicated to develop composites that are thermally conductive yet electrically insulative. Incorporating hexagonal boron nitride (h-BN) as fillers shows promise in enhancing the thermal conductivity of polymer composites. However, notable challenges arise from difficulties in achieving well dispersion and establishing efficient three-dimensional thermal conductive networks. This work demonstrated an efficient photocurable direct ink writing (DIW) printing method to fabricate functional h-BN nanosheets (A-BNNS)/epoxy acrylate (EA) resin-based thermal conductive composites (A-BNNS/EA). Apple polyphenol-assisted ball milling was employed to fabricate functionalized BN nanosheets (A-BNNS). Subsequently, A-BNNS/EA inks were 3D printed using DIW to create thermally conductive composites, which were then UV-cured. The composite containing 55 wt% A-BNNS demonstrated an impressive thermal conductivity (TC) of 3.44 W/(m K). The utilization of 3D printing technology enables an onion-like dispersion of A-BNNS within the polymer matrix, effectively constructing three-dimensional thermal conductive networks. This contribution significantly enhances the overall thermal conductivity.
引用
收藏
页码:3156 / 3168
页数:13
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