共 56 条
[42]
Reimers J., 2019, IEEE T VEH TECHNOL, VPP, P1
[43]
S. M.R, 2005, POT REFR POW EL COOL
[44]
Saums DL, 2011, P IEEE SEMICOND THER, P253, DOI 10.1109/STHERM.2011.5767209
[45]
Schulz-Harder J., 2006, P INT C INT POW EL S
[48]
Thermal Analysis, Characterization and and Material Selection for SiC Device Based Intelligent Power Module (IPM)
[J].
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020),
2020,
:2078-2085
[50]
Wang P., 2011, ASME 2011 INT MECH E, V11