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Introduction to the Special Issue on Next-Generation On-Chip and Off-Chip Communication Architectures for Edge, Cloud and HPC
被引:0
|作者:
Kim, John
[1
]
Krishna, Tushar
[2
]
机构:
[1] Korea Adv Inst Sci & Technol, Daejeon, South Korea
[2] Georgia Inst Technol, Atlanta, GA USA
关键词:
D O I:
10.1145/3631144
中图分类号:
TP3 [计算技术、计算机技术];
学科分类号:
0812 ;
摘要:
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页数:1
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