Competitive adsorption of Cu2+ and chloride ions, polyethylene glycol and sulfur-containing organic additives on copper in sulfuric acid electrolytes

被引:0
|
作者
Andreeva, N. P. [1 ]
Kuznetsov, I. A. [1 ]
Chirkunov, A. A. [1 ]
Polikarchuk, V. A.
Derkachev, M. S. [2 ]
Kozaderov, O. A. [2 ]
Sotskaya, N. V. [2 ]
Shikhaliev, Kh. S. [2 ]
机构
[1] Russian Acad Sci, AN Frumkin Inst Phys Chem & Electrochem, Leninsky Pr 31, Moscow 119071, Russia
[2] Voronezh State Univ, Universitetskaya Pl 1, Voronezh 394018, Russia
来源
INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION | 2023年 / 12卷 / 04期
关键词
copper; adsorption; ellipsometry; Temkin isotherm; brightening agent; UNDERPOTENTIAL DEPOSITION; CORROSION-INHIBITORS; AQUEOUS-SOLUTIONS; ELECTRODEPOSITION; PEG; CL; ELLIPSOMETRY; GELATIN; BATHS;
D O I
10.17675/2305-6894-2023-12-4-54
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A model electrolyte (0.5 M H2SO4 + 0.1 g/L CuSO4) was proposed to study the co-adsorption of chloride ions and organic additives by the ellipsometric method. Commercial additives Avangard, APhDS (bis(2-aminophenyl)disulfide), and the PEG-115 inhibitor employed in copper electrodeposition were used as brightening agents. The mixture of NaCl and PEG-115 is practically not adsorbed on the electrode. Avangard and APhDS enhance the adsorption of NaCl and PEG-115 when added sequentially. Comparison of the effect of Avangard and APhDS on the adsorption of the mixture (NaCl + PEG-115) shows that APhDS additive has a stronger stimulating effect on adsorption. The adsorption isotherm of APhDS on the surface of a copper electrode from the 0.5 M H2SO4 + 0.1 g/L CuSO4 solution at E= 0 V was obtained. The adsorption isotherm is described by the Temkin equation. The value of adsorption free energy -triangle G(ads)(0) = 33.57 kJ/mol suggests chemical adsorption of APhDS on the surface.y
引用
收藏
页码:2482 / 2495
页数:14
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