Effect of solid solution elements on cracking susceptibility of Ni-based superalloys during additive manufacturing

被引:7
|
作者
Zhang, Xue [1 ,2 ]
Mu, Yahang [1 ,2 ]
Lu, Nannan [2 ]
Li, Qi [2 ]
Chen, Shaofeng [2 ,3 ]
Zhou, Yizhou [2 ]
Sun, Xiaofeng [2 ]
Liang, Jingjing [1 ,2 ]
Li, Jinguo [1 ,2 ]
机构
[1] Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
[2] Chinese Acad Sci, Inst Met Res, Shi changxu Innovat Ctr Adv Mat, Shenyang 110016, Peoples R China
[3] Northeastern Univ, Sch Mat Sci & Engn, Shenyang 110819, Peoples R China
关键词
Additive manufacturing; Ni-based superalloys; Cracking susceptibility; Solid solution elements; SINGLE-CRYSTAL; HOT-CRACKING; MICROSTRUCTURE; MECHANISMS; NICKEL; INCONEL-738; LIQUATION;
D O I
10.1016/j.jmst.2023.11.073
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Alloy composition design usually contributes to eliminating cracking in Ni-based superalloys during additive manufacturing (AM). However, a detailed understanding of each solid solution element in the cracking susceptibility of Ni-based superalloys during AM is still missing. Thirteen newly designed alloys are considered to investigate the combined effect of solid solution elements on cracking susceptibility. The behaviors of solidification cracking, liquation cracking, and solid-state cracking were analyzed by the microstructural characterization and thermodynamic calculations. The results showed that W and Mo cause the formation of high melting-point carbides at grain boundaries (GBs), which increase solidification cracking susceptibility. Moreover, W and Mo lead to a slightly higher solidification cracking index (SCI) compared to Co, Cr, and Re. In the successive solidification and remelting process, the borides enriched in W, Mo, and B around GBs will cause grain boundary segregation and liquation cracking. W and Re extend the freezing range (FR) and exacerbate the segregation of Al and Ti in the inter-dendritic regions, contributing to the formation of eutectics. Similarly, complete or partial melting of the eutectic can induce liquation cracking during the thermal cycling in AM. The solid-state cracking susceptibility can be reduced by solid solution elements, especially Re and Co. In summary, compared to Co, Cr, and Re, W and Mo exacerbate the cracking susceptibility. (c) 2024 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
引用
收藏
页码:218 / 228
页数:11
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