Corrosion problems of SAC-SiC composite solder alloys

被引：15
作者：
Choi, Halim [1 ]
Illes, Balazs [1 ,2 ]
Hurtony, Tamas
Byun, Jaeduk [3 ]
Geczy, Attila [1 ]
Skwarek, Agata [2 ,4 ]
机构：
[1] Budapest Univ Technol & Econ, Fac Elect Engn & Informat, Dept Elect Technol, Budapest, Hungary
[2] LTCC Technol Res Grp, Lukasiewicz Res Network, Inst Microelect & Photon, Krakow, Poland
[3] Dankook Univ, Dept Phys, Cheonan, South Korea
[4] Gdyn Maritime Univ, Dept Marine Elect, Gdynia, Poland
来源：
CORROSION SCIENCE | 2023年 / 224卷
关键词：
SAC-SiC composite alloy; Corrosion; Nano-fiber; Nano-particle; Sn whisker; DFT; AG-CU SOLDER; SN-1.0AG-0.5CU SOLDER; TENSILE PROPERTIES; NANOPARTICLES; TIN; MICROSTRUCTURE; ADDITIONS; MICROHARDNESS; COATINGS;
D O I：
10.1016/j.corsci.2023.111488
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
SiC nano-fibers and nano-particles in 0.5 wt% were mixed into SAC0307 alloy. Solder joints were stored for 4000 h in 85 degrees C/85RH%. The SiC nano-phases decreased the corrosion resistance of the composite solder alloys and increased the Sn whisker growth. Microstructural analysis with SEM and FIB proved that whisker growth was caused by localized corrosion and intermetallic layer growth at the upper meniscus of the solder joints, which effects caused mechanical stress via volumetric changes. DFT simulations proved that although SiC could bond to Sn atoms, but the SiC is prone to corrosion, so SiC acted as corrosion incubation points in the Sn-matrix.
引用
收藏
页数：12
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共 41 条
[1]   The effect of electroplating parameters and substrate material on tin whisker formation [J].
Ashworth, M. A. ;
Wilcox, G. D. ;
Higginson, R. L. ;
Heath, R. J. ;
Liu, C. ;
Mortimer, R. J. .
MICROELECTRONICS RELIABILITY, 2015, 55 (01) :180-191
[2]   Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle [J].
Chen, Guang ;
Liu, Li ;
Silberschmidt, Vadim V. ;
Chan, Y. C. ;
Liu, Changqing ;
Wu, Fengshun .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016, 28 (03) :159-166
[3]   Oxidation study of pure tin and its alloys via electrochemical reduction analysis [J].
Cho, S ;
Yu, J ;
Kang, SK ;
Shih, DY .
JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (05) :635-642
[4]   Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) lead free solder alloy [J].
Eid, E. A. ;
Fouda, A. N. ;
Duraia, El-Shazly M. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 657 :104-114
[5]   Microstructural modifications and properties of SiC nanoparticles-reinforced Sn-3.0Ag-0.5Cu solder alloy [J].
El-Daly, A. A. ;
Desoky, W. M. ;
Elmosalami, T. A. ;
El-Shaarawy, M. G. ;
Abdraboh, A. M. .
MATERIALS & DESIGN, 2015, 65 :1196-1204
[6]   Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy [J].
El-Daly, A. A. ;
Al-Ganainy, G. S. ;
Fawzy, A. ;
Younis, M. J. .
MATERIALS & DESIGN, 2014, 55 :837-845
[7]   Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance [J].
El-Daly, A. A. ;
Fawzy, A. ;
Mansour, S. F. ;
Younis, M. J. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 578 :62-71
[8]   Thermal analysis and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy after modification with SiC nano-sized particles [J].
El-Daly, A. A. ;
Fawzy, A. ;
Mansour, S. F. ;
Younis, M. J. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (08) :2976-2988
[9]   Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys [J].
Gain, Asit Kumar ;
Zhang, Liangchi .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (07) :7524-7533
[10]   Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads [J].
Gain, Asit Kumar ;
Chan, Y. C. ;
Yung, Winco K. C. .
MICROELECTRONICS RELIABILITY, 2011, 51 (12) :2306-2313
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