Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor

被引:47
作者
Chen, Shuwen [1 ]
Fan, Shicheng [2 ]
Qi, Jiaming [2 ]
Xiong, Ze [1 ]
Qiao, Zheng [2 ]
Wu, Zixiong [2 ]
Yeo, Joo Chuan [1 ]
Lim, Chwee Teck [1 ,2 ,3 ,4 ]
机构
[1] Natl Univ Singapore, Inst Hlth Innovat & Technol iHealthtech, Singapore 119276, Singapore
[2] Natl Univ Singapore, Dept Biomed Engn, Singapore 117583, Singapore
[3] Natl Univ Singapore, Mechanobiol Inst, Singapore 117411, Singapore
[4] Natl Univ Singapore, Inst Funct Intelligent Mat, Singapore 117544, Singapore
基金
新加坡国家研究基金会;
关键词
printable electronics; soft-rigid integrated electronics; stretchable bioelectronics; stretchable conductors; wearable electronics; FABRICATION; ELASTOMER; SURFACE; FIBERS; ALLOY; FILMS; SOFT;
D O I
10.1002/adma.202208569
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Human-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm(-1)), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of approximate to 200 mu m. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.
引用
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页数:14
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