Quasi-in-situ observation and analysis of grain boundary evolution of GH4169 nickel-based superalloy during the micro-strain stage of thermal deformation

A systematic study was conducted to analyze the grain boundary microstructure evolution of GH4169 nickel-based superalloy during the micro-strain stage of thermal deformation. A quasi-in-situ EBSD (electron backscatter diffraction) approach was used for observation. Moreover, at a temperature of 1100 degrees C and a strain rate of 0.1 s(-1), a continuous strain uniaxial compression experiment was carried out. We observed the development of the grain boundary structure and the grain boundary deformation. The experimental findings revealed that GH4169 underwent locally inhomogeneous thermal deformation during the micro-strain stage, and the simultaneous occurrences of grain boundary slip, grain rota-tion, and grain boundary migration, exhibiting microstructural diversity. The grain boundary structure changed continuously as a result of the random movement of high -angle grain boundaries. Twin grains displayed a stable structure during the migration of grain boundaries, and their content indicated a considerable decrease as the strain increased. This provides a basis for directing the design of grain boundary engineering since it suggests that twin boundaries are easier to migrate during thermal deformation. In addition, no evidence of dynamic recrystallization was found throughout the entire micro -strain stage and a <101>/<111> micro-texture was observed, which is compatible with common dislocation slips in face-centered cubic crystals. Then, on the basis of the transmission electron microscope images of the microstructure, the numerous forms of grain boundary deformation were rationally explained from the standpoint of the relation mechanisms among grain boundaries and dislocations. Finally, the synergistic mechanism of grain boundary slip and migration is established as the primary mechanism of thermal deformation in the micro-strain stage.(c) 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).