4x100Gb/s PAM4 Multi-Channel Silicon Photonic Chipset With Hybrid Integration of III-V DFB Lasers and Electro-Absorption Modulators

被引:2
作者
Levy, Jacob S. S. [1 ]
Timurdogan, Erman [1 ]
Kuo, Yu-Sheng [1 ]
Lyu, Gap Youl [1 ]
Tsai, Charles [1 ]
Yan, Xuejin [1 ]
Kim, Harqkyun [1 ]
Stagarescu, Cristian
Meneou, Kevin [1 ]
Thomas, Abu [1 ]
Fragkos, Ioannis [1 ]
Sitwell, Geoffrey [1 ]
Trita, Andrea [1 ]
Liu, Yangyang [1 ]
Ziebel, Melissa [1 ]
Byrd, Jerry [1 ]
Steinbach, Sven [2 ]
Chou, Bruce [1 ]
Vis, William [1 ]
Abed, Arin [1 ]
Kwon, Young [1 ]
Nykanen, Henri [3 ]
Lo, Shih-Han [2 ]
Ikonen, Janne [2 ]
Larismaa, Juha [3 ]
Drake, John [2 ]
Benzoni, Albert [1 ]
Minkenberg, Cyriel [1 ,2 ]
Schrans, Thomas [1 ]
Rickman, Andrew [2 ]
机构
[1] Rockley Photon Inc, Pasadena, CA 91101 USA
[2] Rockley Photon Ltd, Newport NP10 8YJ, England
[3] Rockley Photon Oy, Espoo 02150, Finland
关键词
Silicon photonics; Datacenter; distributed feedback laser (DFB); Electro-absorption modulators (EAM); pulse-amplitdue modulation (PAM)-4; TRANSMISSION;
D O I
10.1109/JLT.2023.3263069
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A silicon photonic based transmitter and receiver chipset for 4x106Gb/s 400 GBASE-DR4 data rates is presented. Each channel of the transmitter chip reaches high extinction ratio and optical modulation amplitude (OMA) with a low TDECQ penalty in full compliance with the IEEE standard. The receiver chips possess high responsivity with low polarization dependent loss. The use of discrete III-V arrayed components hybridized onto the silicon platform and passive alignment of single-mode fibers provides a low-cost, compact and scalable solution extendable to even higher aggregate rates and channel count.
引用
收藏
页码:5350 / 5358
页数:9
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