System-Level Reliability Case Studies of High-Performance Automotive and Medical IC Packages

被引：1

作者：

Jiang, Li ^{[1
]}

Li, Guangxu ^{[1
]}

Zeng, Kejun ^{[1
]}

Williamson, Jaimal ^{[1
]}

Murugan, Rajen ^{[1
]}

机构：

[1] Texas Instruments Inc, Semicond Packaging, Dallas, TX 75265 USA

来源：

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC | 2023年

关键词：

system-level reliability; thermal cycling; finite element analysis; FCBGA;

D O I：

10.1109/ECTC51909.2023.00143

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents case studies on improving the system-level reliability, known as BLR (board-level reliability) performance, of QFN (Quad Flat No-lead) and FCBGA (Flip Chip Ball Grid Array) IC packages for automotive and medical applications. Current researchers have focused predominantly on reliability impact from surface-mount processes, solder and package materials. This work first demonstrates the importance of package footprint design and surface-finished materials as critical factors for a comprehensive BLR assessment. This paper also identifies failure modes different from fatigue type of failure in the solder joints. For example, has solder separation due to board-level stress observed in FCBGA packages been misidentified as solder fatigue failures? What about solder fatigue failures immediately post-surface mount as opposed to prolonged thermal and mechanical system-level stresses? Will there be failures inside a package post BLR? These questions are addressed through comprehensive system-level FEA (finite-element analysis) modeling validated through empirical silicon measurements. New reliability failure modes are identified, and design optimization techniques to significantly improve system-level BLR are also proposed for both QFN and FCBGA-types packages.

引用

页码：828 / 833

页数：6

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